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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
3
Delamination Improvement for High Voltage Power Devices:
, In:
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2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) ,
5
Investigation of Solder Void Improvement on Automotive Part:
, In:
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Proceedings of the 12th International Conference on Advances in Mobile Computing and Multimedia ,
13