Weis, Gerald
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1

Thermal and Mechanical characterization of embedded PTCQ pa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Weis, Gerald ; Schwarz, Timo ; Cherman, Vladimir.. - p. 537-541 , 2023
 
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2

A High Power Density SiC MOSFET Inverter Design and Thermal..:

, In: 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe),
 
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3

Qi compliant wireless charger with PCB integrated magnetic ..:

, In: 2019 IEEE Wireless Power Transfer Conference (WPTC),
Weis, Gerald ; Salkovic, Ivan ; Weidinger, Gerald... - p. 203-207 , 2019
 
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14

Reference Values Following ISO Guidelines for Frequently Re..:

Jochum, Klaus Peter ; Weis, Ulrike ; Schwager, Beate...
Geostandards and Geoanalytical Research.  40 (2016)  3 - p. 333-350 , 2016
 
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