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Wernicke, Tobias
22  results:
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1

Investigation on the use of Al-Ge eutectic bonding in the s..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Wang, Jun ; Mannarino, Manuel ; Visker, Jakob... - p. 2008-2012 , 2024
Link: https://doi.org/10.1109/..
 
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2

Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liq..:

Golim, Obert ; Vuorinen, Vesa ; Wernicke, Tobias..
Microelectronic Engineering.  286 (2024)  - p. 112140 , 2024
Link: https://doi.org/10.1016/..
 
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3

0.5 μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatu..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ma, Kai ; Bekiaris, Nikolaos ; Hsu, Ching-Hsiang... - p. 331-336 , 2024
Link: https://doi.org/10.1109/..
 
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4

Recent Developments in Low Temperature Wafer Level Metal Bo..:

Wernicke, Tobias ; Rebhan, Bernhard ; Vuorinen, Vesa...
ECS Transactions.  112 (2023)  3 - p. 247-263 , 2023
Link: https://doi.org/10.1149/..
 
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5

Achieving low-temperature wafer level bonding with Cu-Sn-In..:

Golim, Obert ; Vuorinen, Vesa ; Ross, Glenn...
Scripta Materialia.  222 (2023)  - p. 114998 , 2023
Link: https://doi.org/10.1016/..
 
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6

Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level S..:

Vuorinen, Vesa ; Ross, Glenn ; Klami, Anton...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  3 - p. 446-453 , 2022
Link: https://doi.org/10.1109/..
 
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7

Study of Cu-Sn-In system for low temperature, wafer level s..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Hotchkiss, Joseph ; Vuorinen, Vesa ; Dong, Hongqun... - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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8

Low temperature formation of CuIn 1−x Ga x Se 2 solar cell ..:

Möckel, Stefan A. ; Wernicke, Tobias ; Arzig, Matthias...
Thin Solid Films.  582 (2015)  - p. 60-68 , 2015
Link: https://doi.org/10.1016/..
 
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9

Achieving low-temperature wafer level bonding with Cu-Sn-In..:

Golim, Obert ; Vuorinen, Vesa ; Ross, Glenn...
Scripta Materialia.  , 2023
Link: https://aaltodoc.aalto.f..
 
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10

Demonstrating 170°C Low Temperature Cu-In-Sn wafer level So..:

Vuorinen, Vesa ; Ross, Glenn ; Klami, Anton...
info:eu-repo/grantAgreement/EC/H2020/826588/EU//APPLAUSE.  , 2022
Link: https://aaltodoc.aalto.f..
 
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11

Study of Cu-Sn-In system for low temperature, wafer level s..:

Hotchkiss, Joseph ; Vuorinen, Vesa ; Dong, Hongqun...
info:eu-repo/grantAgreement/EC/H2020/826588/EU//APPLAUSE.  , 2020
Link: https://aaltodoc.aalto.f..
 
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12

Incremental value of C‐reactive protein to the MEESSI acute..:

Wussler, Desiree ; Belkin, Maria ; Shrestha, Samyut...
European Journal of Heart Failure.  , 2024
Link: https://doi.org/10.1002/..
 
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13

Preparing Teachers to Work with Multilingual Learners 

Bilingual Education & Bilingualism ; 130
Berbić Kolar, Emina ; Berkel-Otto, Lisa ; Bilić Meštrić, Klara... , [2021]
Link: https://doi.org/10.21832..
 
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14

Preparing teachers to work with multilingual learners 

Bilingual education & bilingualism, 130
Wernicke, Meike ; Hammer, Svenja ; Hansen, Antje. , 2021
Link: https://search.ebscohost..
 
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15

Assessing moisture sources of precipitation in the Western ..:

Juhlke, Tobias R. ; Meier, Christiane ; Van Geldern, Robert...
Tellus B: Chemical and Physical Meteorology.  71 (2019)  1 - p. 1601987 , 2019
Link: https://doi.org/10.1080/..
 
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