E-LIB Suche - Ergebnisse für: Wiemer, Maik

1

Process Development of Aluminum Electroplating from an Ioni..:

Braun, Silvia ; Wiemer, Maik ; Schulz, Stefan E.
Micromachines. 15 (2024) 6 - p. 746 , 2024

Link: https://doi.org/10.3390/..

2

Inductive Heating Based on VHF-ISM Radio Band Frequencies a..:

Hofmann, Christian ; Kroll, Martin ; Panhale, Sushant...
IEEE Transactions on Magnetics. 59 (2023) 11 - p. 1-5 , 2023

Link: https://doi.org/10.1109/..

3

Recent Developments in Low Temperature Wafer Level Metal Bo..:

Wernicke, Tobias ; Rebhan, Bernhard ; Vuorinen, Vesa...
ECS Transactions. 112 (2023) 3 - p. 247-263 , 2023

Link: https://doi.org/10.1149/..

4

Advances in Parylene Adhesive Bonding for the Realization o..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),

Selbmann, Franz ; Roscher, Frank ; Wiemer, Maik.. - p. 1-6 , 2023

Link: https://doi.org/10.23919..

5

Paradigm Changing Integration Technology for the Production..:

Selbmann, Franz ; Paul, Soumya Deep ; Satwara, Maulik...
Micromachines. 14 (2023) 2 - p. 415 , 2023

Link: https://doi.org/10.3390/..

6

Impact of Dielectric and Copper Via Design on Wafer-to-Wafe..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Dubey, Vikas ; Wunsch, Dirk ; Gottfried, Knut... - p. 795-799 , 2023

Link: https://doi.org/10.1109/..

7

Process and Design Challenges for Hybrid Bonding:

Dubey, Vikas ; Wünsch, Dirk ; Gottfried, Knut...
ECS Transactions. 112 (2023) 3 - p. 73-81 , 2023

Link: https://doi.org/10.1149/..

8

Investigation of the Processing Behavior and Stability of D..:

Knechtel, Roy ; Wenig, Micaela ; Svoboda, Stefan...
ECS Transactions. 112 (2023) 3 - p. 229-246 , 2023

Link: https://doi.org/10.1149/..

9

Inductive heating based on VHF-ISM radio band frequencies a..:

, In: 2023 IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers),

Hofmann, Christian ; Kroll, Martin ; Panhale, Sushant... - p. 1-2 , 2023

Link: https://doi.org/10.1109/..

10

Optimal design configuration for aluminum pillar fabricatio..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),

Cirulis, Imants ; Braun, Silvia ; Vogel, Klaus... - p. 6-10 , 2022

Link: https://doi.org/10.1109/..

11

Impact of Non-Accelerated Aging on the Properties of Paryle..:

Selbmann, Franz ; Scherf, Christina ; Langenickel, Jörn...
Polymers. 14 (2022) 23 - p. 5246 , 2022

Link: https://doi.org/10.3390/..

12

Additive manufacturing of capacitive humidity sensors by sc..:

Seifert, Tobias ; Martin, Jörg ; Seider, Thomas..
Technologies for Lightweight Structures (TLS). 1 (2022) 2 - p. 197-207 , 2022

Link: https://doi.org/10.21935..

13

High Precision Liquid Level and Leak Detection Based on Cap..:

, In: 2022 Smart Systems Integration (SSI),

Saeidi, Nooshin ; Selvam, Karman ; Tortato, Felipe.. - p. 1-5 , 2022

Link: https://doi.org/10.1109/..

14

Laser soldered wire bonding on liquid printed and sputtered..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

Fettke, Matthias ; Kubsch, Timo ; Fisch, Anne... - p. 1430-1441 , 2022

Link: https://doi.org/10.1109/..

15

Localized Induction Heating of Cu-Sn Layers for Rapid Solid..:

Hofmann, Christian ; Satwara, Maulik ; Kroll, Martin...
Micromachines. 13 (2022) 8 - p. 1307 , 2022

Link: https://doi.org/10.3390/..