Search for persons
X
?
3
Erforschung eines Plug & Play Range Extender Moduls zur onb..
Abschlussbericht zum Verbundvorhaben
?
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
9
SiC Fan-out Wafer Level Package for High Power Application:
, In:
?
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
11