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Wittler, Olaf
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1

Influence of Geometry Effects on Thermo-Mechanical Reliabil..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Kilian, Borja ; Maniar, Youssef ; Gleichauf, Jonas.. - p. 1-10 , 2024
Link: https://doi.org/10.1109/..
 
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2

Behavior of Different Ultrasonically Bonded Aluminum Heavy ..:

Kuttler, Simon ; Wittler, Olaf ; Schneider-Ramelow, Martin
Journal of Electronic Materials.  , 2024
Link: https://doi.org/10.1007/..
 
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3

Assessing thermal resistance as a degradation metric for so..:

Kilian, Borja ; Gleichauf, Jonas ; Maniar, Youssef..
Microelectronics Reliability.  156 (2024)  - p. 115388 , 2024
Link: https://doi.org/10.1016/..
 
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4

Analyzing the Influence of RDL Stack-up on Wafer Warpage in..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Huber, Saskia ; Scheibe, Philipp ; Mutlu, Sukrucan.. - p. 1018-1024 , 2024
Link: https://doi.org/10.1109/..
 
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5

Numerical simulation approach for consideration of ageing e..:

van Dijk, Marius ; Wittler, Olaf ; Wagner, Stefan.
Microelectronics Reliability.  157 (2024)  - p. 115403 , 2024
Link: https://doi.org/10.1016/..
 
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6

Analysis of the Impact of Environmental Conditions on the R..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Walter, Hans ; Wittler, Olaf ; Van Dijk, Marius... - p. 1-7 , 2023
Link: https://doi.org/10.23919..
 
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7

Improving Warpage Characterization of Large Wafers in Fan-O..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Huber, Saskia ; Stegmaier, Andreas ; van Dijk, Marius... - p. 1332-1338 , 2023
Link: https://doi.org/10.1109/..
 
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8

Warpage of Fan-Out Panel Level Packaging – Experimental and..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Stegmaier, Andreas ; Holck, Ole ; Dijk, Marius van... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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9

Modification of Prony Series Coefficients to Account for Th..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Dijk, Marius van ; Wittler, Olaf ; Wagner, Stefan. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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10

Determination of Lemaitre Damage Parameters for Al H11 Wire..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Kuttler, Simon ; Abali, Bilen Emek ; Wittler, Olaf - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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11

Finite Element-Based Monitoring of Solder Degradation in Di..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Kilian, Borja ; Gleichauf, Jonas ; Maniar, Youssef.. - p. 1-8 , 2023
Link: https://doi.org/10.1109/..
 
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12

Finite Element Influence Analysis of Power Module Design Op..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
van Dijk, Marius ; Wittler, Olaf ; Hung, Ping-Chi... - p. 1770-1776 , 2022
Link: https://doi.org/10.1109/..
 
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13

SiC Fan-out Wafer Level Package for High Power Application:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Mackowiak, Piotr ; Wittler, Olaf ; Braun, Tanja... - p. 104-108 , 2022
Link: https://doi.org/10.1109/..
 
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14

Numerical simulation of transient thermomechanical ageing e..:

, In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
van Dijk, Marius ; Huber, Saskia ; Walter, Hans.. - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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15

Potentials of a SiC Fan-out Wafer Level Package for High Po..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Mackowiak, Piotr ; Wittler, Olaf ; Braun, Tanja... - p. 45-48 , 2022
Link: https://doi.org/10.1109/..
 
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