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Wu, Houya
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1

Effects of Temperature on the Adhesive Performance of High ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Zhao, Guolin ; Yang, Yuanyuan ; Peng, Xiaohui... - p. 2275-2280 , 2022
Link: https://doi.org/10.1109/..
 
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2

Effect of Silane Coupling Agents on the Underfill Adhesion ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Zhao, Guolin ; Lin, Haoliang ; Zhang, Ruoyu... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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3

Fast Filling of Microvia by Pre-Settling Particles and Foll..:

Li, Ganglong ; Li, Zhiyi ; Li, Junjie.
Nanomaterials.  12 (2022)  10 - p. 1699 , 2022
Link: https://doi.org/10.3390/..
 
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4

Cu-Cu joint formation by low-temperature sintering of self-..:

Yuan, Yulei ; Wu, Houya ; Li, Junjie..
Applied Surface Science.  570 (2021)  - p. 151220 , 2021
Link: https://doi.org/10.1016/..
 
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5

Surface Decoration of Cetyltrimethyl Ammonium Bromide on Si..:

Wu, Houya ; Li, Zhiyi ; Wang, Yan.
The Journal of Physical Chemistry B.  125 (2021)  18 - p. 4874-4882 , 2021
Link: https://doi.org/10.1021/..
 
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6

Underfill Filler Settling Effect on the Adhesive Force of F..:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),
Zhao, Guolin ; Wu, Houya ; Yang, Yuanyuan... - p. 1-5 , 2021
Link: https://doi.org/10.1109/..
 
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7

The Effect of Toughening Agents on Capillary Underfill in t..:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),
Yang, Yuanyuan ; Wu, Houya ; Peng, Tao... - p. 1-5 , 2021
Link: https://doi.org/10.1109/..
 
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8

Communication—Effects of Molecular Structures of Quaternary..:

Li, Zhiyi ; Wu, Houya ; Wang, Yan.
Journal of The Electrochemical Society.  168 (2021)  10 - p. 102506 , 2021
Link: https://doi.org/10.1149/..
 
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9

Investigations of the electrochemical performance and filli..:

Wu, Houya ; Wang, Yan ; Li, Zhiyi.
Scientific Reports.  10 (2020)  1 - p. , 2020
Link: https://doi.org/10.1038/..
 
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10

Communication—Fast Bottom-Up Filling of High Aspect Ratio M..:

Wu, Houya ; Li, Zhiyi ; Wang, Yan.
Journal of The Electrochemical Society.  167 (2020)  13 - p. 132507 , 2020
Link: https://doi.org/10.1149/..
 
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11

Experimental Analysis of the Co-Deposition of Metal Cu and ..:

Wu, Houya ; Li, Zhiyi ; Wang, Yan...
Journal of The Electrochemical Society.  166 (2019)  8 - p. D237-D243 , 2019
Link: https://doi.org/10.1149/..
 
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12

Inhibition Effect of CTAB on Electrodeposition of Cu in Mic..:

Wu, Houya ; Li, Zhiyi ; Wang, Yan..
Journal of The Electrochemical Society.  166 (2019)  15 - p. D816-D825 , 2019
Link: https://doi.org/10.1149/..
 
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13

Effects of JGB and PEG on Through Silicon Via Filling Proce..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Li, Zhiyi ; Wu, Houya ; Wang, Yan. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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14

Co-deposition of Nano-Size SiC Particles in Micro-Via:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Wu, Houya ; He, Hu ; Wang, Yan... - p. 1170-1175 , 2018
Link: https://doi.org/10.1109/..
 
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15

Fast Filling of Microvia by Pre-Settling Particles and Foll..:

Li, Ganglong ; Li, Zhiyi ; Li, Junjie.
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC9143643/.  , 2022
Link: http://www.ncbi.nlm.nih...
 
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