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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
1
A Mechanics Model for the Moisture Induced Delamination in ..:
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2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Coupled Hygro-Thermo-Mechanical Analysis of Moisture Induce..:
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Nonlinear Structures & Systems, Volume 1; Conference Proceedings of the Society for Experimental Mechanics Series ,
4