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Wu, Liye
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1

Switching Sequence Predictive Control of Modular Multilevel..:

Li, Yufan ; Sun, Yichao ; Teixeira, Carlos Alberto...
IEEE Transactions on Industry Applications.  60 (2024)  4 - p. 6422-6434 , 2024
Link: https://doi.org/10.1109/..
 
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2

Stress-strain analysis and optimization of laminated solder..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wu, Liye ; Huang, Chunyue ; Liu, Xiaobin... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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3

Stress-strain analysis and optimization of TSV interconnect..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Lilin ; Huang, Chunyue ; Wu, Liye... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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4

Thermal stress analysis and optimization of BGA stacked sol..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Xianjia ; Huang, Chunyue ; Wang, Lilin... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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5

Study of TSV Interconnection Structure Based on Coupled Hig..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Bin ; Huang, Chunyue ; Gao, Chao... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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6

Energy Coordinated Control Method for High Power Density Po..:

, In: The Proceedings of 2022 International Conference on Wireless Power Transfer (ICWPT2022); Lecture Notes in Electrical Engineering,
Cao, Ziqing ; Sun, Yichao ; Wu, Liye.. - p. 901-908 , 2023
Link: https://doi.org/10.1007/..
 
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7

Modular Optimization of a Fourth-Order Waveguide Filter Wit..:

Guo, Zai-Cheng ; Chen, Longji ; Wu, Liye.
IEEE Transactions on Plasma Science.  51 (2023)  7 - p. 2093-2097 , 2023
Link: https://doi.org/10.1109/..
 
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8

QFP solder joint bending stress analysis and parameter opti..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Liu, Xianjia ; Huang, Chunyue ; Wang, Lilin... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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9

Design and FPGA Implementation of a Real-time Simulation Pl..:

, In: 2022 IEEE Energy Conversion Congress and Exposition (ECCE),
Wu, Liye ; Sun, Yichao ; Teixeira, Carlos... - p. 1-8 , 2022
Link: https://doi.org/10.1109/..
 
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10

Stress-Strain Analysis and Parameter Optimization of Sop So..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wu, Liye ; Huang, Chunyue ; Liu, Xiaobin... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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11

Model Predictive Control of a Modular Multilevel DC Transfo..:

, In: 2022 IEEE Energy Conversion Congress and Exposition (ECCE),
Li, Yufan ; Sun, Yichao ; Teixeira, Carlos... - p. 1-8 , 2022
Link: https://doi.org/10.1109/..
 
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12

Stress Analysis and Optimization of BGA Solder Joints Under..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Liu, Xiaobin ; Huang, Chunyue ; Wu, Liye... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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13

Stress analysis and optimization of microscale CSP solder j..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Lilin ; Huang, Chunyue ; Liu, Xianjia... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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14

Arginine methylation is required for remodelling pre‐mRNA s..:

Li, Zhiqiang ; Wu, Liye ; Wu, Hang...
New Phytologist.  225 (2019)  1 - p. 413-429 , 2019
Link: https://doi.org/10.1111/..
 
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15

Proteomic Analysis of Ubiquitinated Proteins in Rice (Oryza..:

Chen, Xiao-Lin ; Xie, Xin ; Wu, Liye...
Frontiers in Plant Science.  9 (2018)  - p. , 2018
Link: https://doi.org/10.3389/..
 
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