Wu, Shih-Jeh
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1

Laser Applications in Power Management IC Packaging:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Lu, Wei-Yu ; Wu, Shih-Jeh ; Hsu, Hsiang-Chen. - p. 89-90 , 2024
 
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2

TGV drilling by Ultrafast Laser with Hollow Beam Optics:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsu, Hsiang-Chen ; Wu, Shih-Jeh ; Lu, Wei-Yu. - p. 69-70 , 2024
 
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6

A hybrid method of ultrafast laser dicing and high density ..:

Wu, Shih-jeh
Materials Science in Semiconductor Processing.  74 (2018)  - p. 64-73 , 2018
 
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9

An investigation on ultrathin wafer dicing by ultrafast las..:

, In: 2017 International Conference on Electronics Packaging (ICEP),
Wu, Shih-jeh ; Hsu, Hsiang-Chen ; Lin, Wen-Fei. - p. 139-143 , 2017
 
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11

Novel design and fabrication of a geometrical obstacle-embe..:

Wu, Shih-Jeh ; Hsu, Hsiang-Chen ; Feng, Wen-Jui
Japanese Journal of Applied Physics.  53 (2014)  9 - p. 097201 , 2014
 
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12

Microstructural evolution and formation of highly c-axis-or..:

Liu, Wen-Jen ; Wu, Shih-Jeh ; Chen, Chih-Min..
Journal of Crystal Growth.  276 (2005)  3-4 - p. 525-533 , 2005
 
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14

Design of Two-Track Surface Acoustic Wave Filters with Widt..:

Ro, Ruyen ; Tung, Hsin-Yuan ; Wu, Shih-Jeh
Japanese Journal of Applied Physics.  43 (2004)  2 - p. 688-694 , 2004
 
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