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Computational and Experimental Simulations in Engineering; Mechanisms and Machine Science ,
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Effect of Space Environment on the Reliability of Conductiv..:
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2023 International Conference on Microwave and Millimeter Wave Technology (ICMMT) ,
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Board-level Interconnection Reliability Study of T/R Module..:
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2021 22nd International Conference on Electronic Packaging Technology (ICEPT) ,
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Mechanical Behavior of Lead-free Solder at High Temperature..:
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2020 China Semiconductor Technology International Conference (CSTIC) ,
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Characterterization of Multi-Scale Nanosilver Paste Reinfor..:
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2019 20th International Conference on Electronic Packaging Technology(ICEPT) ,
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