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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
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Correlation Analysis between Warpage and Metal Thermal Inte..:
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2023 IEEE IAS Global Conference on Emerging Technologies (GlobConET) ,
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Research on Ultra-Short Term Distributed PV Power Forecasti..:
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2023 China Semiconductor Technology International Conference (CSTIC) ,
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Reliability analysis of metal thermal interface materials f..:
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2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Organic Thermal Interface Materials Delamination Analysis o..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
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Investigation on the thermo-mechanical reliability of bump ..:
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2023 ACM/IEEE 5th Workshop on Machine Learning for CAD (MLCAD) ,
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