E-LIB Suche - Ergebnisse für: Xi-Shu Wang

1

The Improved Dijkstra's Shortest Path Algorithm and Its App..:

Shu-Xi, Wang
Procedia Engineering. 29 (2012) - p. 1186-1190 , 2012

Link: https://doi.org/10.1016/..

2

Prediction of energy and exergy of mushroom slices drying i..:

Liu, Zi-Liang ; Bai, Jun-Wen ; Wang, Shu-Xi...
Drying Technology. 38 (2019) 15 - p. 1959-1970 , 2019

Link: https://doi.org/10.1080/..

3

Influence of Multi-Holes on Fatigue Behaviors of Cast Magne..:

Wang, Xi-Shu ; Tan, Chang-Hao ; Ma, Juan..
Materials. 11 (2018) 9 - p. 1700 , 2018

Link: https://doi.org/10.3390/..

4

Microarc Oxidation Coating Combined with Surface Pore-Seali..:

Yang, Hui-Hui ; Wang, Xi-Shu ; Wang, Ya-Ming..
Materials. 10 (2017) 6 - p. 609 , 2017

Link: https://doi.org/10.3390/..

5

High-Cycle Microscopic Severe Corrosion Fatigue Behavior an..:

Wang, Yan-Ling ; Wang, Xi-Shu ; Wu, Sheng-Chuan..
Metals. 7 (2017) 4 - p. 134 , 2017

Link: https://doi.org/10.3390/..

6

Simulation study on thermo-fatigue failure behavior of sold..:

Zhang, Zhi-Hao ; Wang, Xi-Shu ; Ren, Huai-Hui..
Microelectronics Reliability. 75 (2017) - p. 127-134 , 2017

Link: https://doi.org/10.1016/..

7

Surrogate endpoint for overall survival in assessment of ad..:

Huan, Hong-Bo ; Wu, Li-Li ; Lau, Wan-Yee...
Oncotarget. 8 (2017) 52 - p. 90291-90300 , 2017

Link: https://doi.org/10.18632..

8

Evaluation of the critical stress of anodized coating-AZ91D..:

WANG, Xi-shu
Journal of Zhejiang University Science A. 17 (2016) - p. 65-75 , 2016

Link: https://doi.org/10.1631/..

9

T–M coupled effects on cracking behaviors and reliability a..:

Zuo, Jian-Ping ; Wang, Xi-Shu ; Mao, De-Qiang..
Engineering Fracture Mechanics. 158 (2016) - p. 106-115 , 2016

Link: https://doi.org/10.1016/..

10

SEM in-situ study on the effect of offset-notch on basalt c..:

Zuo, Jian-Ping ; Wang, Xi-Shu ; Mao, De-Qiang
Engineering Fracture Mechanics. 131 (2014) - p. 504-513 , 2014

Link: https://doi.org/10.1016/..

11

Improvement on the Fatigue Performance of 2024-T4 Alloy by ..:

Wang, Xi-Shu ; Guo, Xing-Wu ; Li, Xu-Dong.
Materials. 7 (2014) 5 - p. 3533-3546 , 2014

Link: https://doi.org/10.3390/..

12

Fatigue damage behavior of a surface-mount electronic packa..:

Ren, Huai-Hui ; Wang, Xi-Shu
Chinese Physics B. 23 (2014) 4 - p. 044601 , 2014

Link: https://doi.org/10.1088/..

13

Effects of solder balls and arrays on the failure behavior ..:

Wang, Xi-Shu ; Jia, Su ; Ren, Huai-Hui.
Microelectronics Reliability. 54 (2014) 3 - p. 633-640 , 2014

Link: https://doi.org/10.1016/..

14

Fracture analysis on die attach adhesives for stacked packa..:

Ren, Huai-Hui ; Wang, Xi-Shu ; Jia, Su
Microelectronics Reliability. 53 (2013) 7 - p. 1021-1028 , 2013

Link: https://doi.org/10.1016/..

15

Experimental and theoretical analyses of package-on-package..:

Jia, Su ; Wang, Xi-Shu ; Ren, Huai-Hui
Chinese Physics B. 21 (2012) 12 - p. 126201 , 2012

Link: https://doi.org/10.1088/..