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Xiaomin, Li
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1

Faster AU-AL IMC Growth Under Chlorine Environment:

, In: 2023 China Semiconductor Technology International Conference (CSTIC),
Lois, Liao Jinzhi ; Bisheng, Wang ; Xi, Zhang.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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2

Study of moisture penetration in chip passivation layer by ..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Lois, Liao Jinzhi ; Bisheng, Wang ; Xi, Zhang.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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3

Effects of temperature and electrical bias on Cu-Al IMCs gr..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Liao, Lois ; Zhang, Chencang ; Liu, Ting... - p. 906-909 , 2023
Link: https://doi.org/10.1109/..
 
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4

Chlorine and sulfur effects on copper-aluminum wire bond re..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Lois, Liao Jinzhi ; Bisheng, Wang ; Xi, Zhang.. - p. 749-752 , 2022
Link: https://doi.org/10.1109/..
 
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5

Studies of Electron Backscattered Diffraction (EBSD) Analys..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Younan, Hua ; Binghai, Liu ; Lois, Liao Jinzhi... - p. 821-825 , 2022
Link: https://doi.org/10.1109/..
 
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6

Study of moisture penetration in polymer encapsulant by deu..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Lois, Liao Jinzhi ; Bisheng, Wang ; Xi, Zhang.. - p. 826-828 , 2022
Link: https://doi.org/10.1109/..
 
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7

Application of deuterium oxide (D2O) isotope tracing techni..:

Lois, Liao Jinzhi ; Meng, Tian ; Yong, Du...
Microelectronics Reliability.  135 (2022)  - p. 114607 , 2022
Link: https://doi.org/10.1016/..
 
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8

Comprehensive Comparison of the Wire Bond Reliability Perfo..:

, In: 2020 China Semiconductor Technology International Conference (CSTIC),
Lois, Liao Jinzhi ; Minglang, Yu ; Weikok, Tee... - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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9

Piloting PISA for development to success: an analysis of it..:

Auld, Euan ; Xiaomin, Li ; Morris, Paul
Compare: A Journal of Comparative and International Education.  52 (2020)  7 - p. 1145-1169 , 2020
Link: https://doi.org/10.1080/..
 
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10

bHAST, PCT, TCT reliability performance comparison of Cu-Al..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Lois, Liao Jinzhi ; Weikok, Tee ; Minglang, Yu... - p. 63-67 , 2020
Link: https://doi.org/10.1109/..
 
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11

Model and Experimental Study of Online measurement of multi..:

, In: Proceedings of the 2nd International Conference on Industrial Control Network And System Engineering Research,
Chaodong, Tan ; Ziqin, Zhang ; Haoda, Wu... - p. 28-35 , 2020
Link: https://dl.acm.org/doi/1..
 
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12

A historical perspective on the OECD's 'humanitarian turn':..:

Xiaomin, Li ; Auld, Euan
Comparative Education.  56 (2020)  4 - p. 503-521 , 2020
Link: https://doi.org/10.1080/..
 
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13

Realization of Hydraulic Control System of Horizontal Rotar..:

, In: 2020 IEEE International Conference on Advances in Electrical Engineering and Computer Applications( AEECA),
Rihong, Zhang ; Songxia, Yang ; Xiaomin, Li - p. 496-499 , 2020
Link: https://doi.org/10.1109/..
 
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14

Double-color digital image watermarking technology based on..:

, In: 2020 IEEE International Conference on Artificial Intelligence and Computer Applications (ICAICA),
Xiaomin, Li ; Fengyuan, Zhang - p. 52-55 , 2020
Link: https://doi.org/10.1109/..
 
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15

Enhancing High Temperature Adhesion Performance Via a Renov..:

, In: 2020 China Semiconductor Technology International Conference (CSTIC),
Neoh, Din-Ghee ; Weikok, Tee ; Lois, Liao Jinzhi... - p. 1-8 , 2020
Link: https://doi.org/10.1109/..
 
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