E-LIB Suche - Ergebnisse für: Xue, Song-bai

1

Thermal reliabilities of Sn-0.5Ag-0.7Cu-0.1Al2O3/Cu solder ..:

WU, Jie ; HUANG, Guo-qiang ; XUE, Song-bai..
Transactions of Nonferrous Metals Society of China. 32 (2022) 10 - p. 3312-3320 , 2022

Link: https://doi.org/10.1016/..

2

Properties and microstructure of Sn–0.7Cu–0.05Ni lead-free ..:

Liu, Shuang ; Xue, Song-bai ; Zhong, Su-juan..
Journal of Materials Science: Materials in Electronics. 30 (2018) 2 - p. 1400-1410 , 2018

Link: https://doi.org/10.1007/..

3

Effect of combinative addition of Ti and Sr on modification..:

WANG, Bo ; XUE, Song-bai ; MA, Chao-li..
Transactions of Nonferrous Metals Society of China. 27 (2017) 2 - p. 272-281 , 2017

Link: https://doi.org/10.1016/..

4

Recent progress of Sn–Ag–Cu lead-free solders bearing alloy..:

Wu, Jie ; Xue, Song-bai ; Wang, Jing-wen...
Journal of Materials Science: Materials in Electronics. 27 (2016) 12 - p. 12729-12763 , 2016

Link: https://doi.org/10.1007/..

5

Present status of Sn–Zn lead-free solders bearing alloying ..:

Liu, Shuang ; Xue, Song-bai ; Xue, Peng.
Journal of Materials Science: Materials in Electronics. 26 (2015) 7 - p. 4389-4411 , 2015

Link: https://doi.org/10.1007/..

6

Reliability study of lead-free solders under specific condi..:

Liu, Shuang ; Xue, Song-bai
Journal of Materials Science: Materials in Electronics. 26 (2015) 12 - p. 9424-9442 , 2015

Link: https://doi.org/10.1007/..

7

Effect of Ag on the properties of solders and brazing fille..:

Wang, He ; Xue, Song-bai
Journal of Materials Science: Materials in Electronics. 27 (2015) 1 - p. 1-13 , 2015

Link: https://doi.org/10.1007/..

8

Saturation phenomenon of Ce and Ti in the modification of A..:

Yang, Jin-long ; Xue, Song-bai ; Dai, Wei.
International Journal of Minerals, Metallurgy, and Materials. 22 (2015) 2 - p. 184-189 , 2015

Link: https://doi.org/10.1007/..

9

Mechanism of Reaction Between Nd and Ga in Sn-Zn-0.5Ga-xNd ..:

Xue, Peng ; Xue, Song-bai ; Shen, Yi-Fu..
Journal of Electronic Materials. 43 (2014) 9 - p. 3404-3410 , 2014

Link: https://doi.org/10.1007/..

10

Investigation on the intermetallic compound layer growth of..:

Luo, Dong-xue ; Xue, Song-bai ; Liu, Shuang
Journal of Materials Science: Materials in Electronics. 25 (2014) 12 - p. 5195-5200 , 2014

Link: https://doi.org/10.1007/..

11

Interfacial microstructures and mechanical properties of Sn..:

Xue, Peng ; Xue, Song-bai ; Shen, Yi-fu.
Materials & Design. 60 (2014) - p. 1-6 , 2014

Link: https://doi.org/10.1016/..

12

Wettability and interfacial whiskers of Sn–9Zn–0.5Ga–0.08Nd..:

Xue, Peng ; Xue, Song-bai ; Shen, Yi-fu..
Journal of Materials Science: Materials in Electronics. 25 (2014) 8 - p. 3520-3525 , 2014

Link: https://doi.org/10.1007/..

13

Investigation on the intermetallic compound layer growth of..:

Xue, Peng ; Xue, Song-bai ; Shen, Yi-fu..
Journal of Materials Science: Materials in Electronics. 25 (2014) 10 - p. 4219-4224 , 2014

Link: https://doi.org/10.1007/..

14

Effects of Ga addition on microstructure and properties of ..:

Luo, Dong-xue ; Xue, Song-bai ; Li, Zai-qian
Journal of Materials Science: Materials in Electronics. 25 (2014) 8 - p. 3566-3571 , 2014

Link: https://doi.org/10.1007/..

15

Inhibiting the growth of Sn whisker in Sn-9Zn lead-free sol..:

Xue, Peng ; Xue, Song-bai ; Shen, Yi-fu.
Journal of Materials Science: Materials in Electronics. 25 (2014) 6 - p. 2671-2675 , 2014

Link: https://doi.org/10.1007/..