Yamamoto, Kazunori
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4

Pressure-assist Silver Sintering Paste for SiC Power Device..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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6

Mechanical simulation and modeling for reliability of 6-in-..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Mandal, Rathin ; Yamamoto, Kazunori ; Tang, Gongyue - p. 1624-1628 , 2022
 
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7

Electrical Design and Modeling of Silicon Carbide Power Mod..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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Performance Evaluation of High-Performance and Flexible Pro..:

, In: 2020 - 5th International Conference on Information Technology (InCIT),
 
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9

Transient Thermal Evaluation of SiC Chip Based Power Module..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
 
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12

Development of Mold-First Fan-Out Panel-Level Packaging (FO..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
 
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13

Power Module on Copper Lead Frame with Novel Sintering Past..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
 
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14

Development of RDL-1stFan-Out Panel-Level Packaging (FO-PLP..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
 
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15

Study on Stress and Reliability of Advanced Intelligent Pow..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
 
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