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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Pressure-assist Silver Sintering Paste for SiC Power Device..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Mechanical simulation and modeling for reliability of 6-in-..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Electrical Design and Modeling of Silicon Carbide Power Mod..:
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2020 - 5th International Conference on Information Technology (InCIT) ,
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Performance Evaluation of High-Performance and Flexible Pro..:
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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
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Transient Thermal Evaluation of SiC Chip Based Power Module..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Development of Mold-First Fan-Out Panel-Level Packaging (FO..:
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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
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Power Module on Copper Lead Frame with Novel Sintering Past..:
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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
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Development of RDL-1stFan-Out Panel-Level Packaging (FO-PLP..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
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