Yan, Hai-Dong
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1

Heterogeneous Bonding with Nanostructured Silver Langmuir-B..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Deng, Xin ; Yan, Hai-Dong ; Hu, Xiaokai... - p. 1-5 , 2022
 
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2

Mechanistic insights into the amelioration effects of lipop..:

Gao, Zhi-dan ; Yan, Hai-dong ; Wu, Ning-hua...
Pulmonary Pharmacology & Therapeutics.  73-74 (2022)  - p. 102121 , 2022
 
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4

Shear performance of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu sol..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Gui, Jun ; Li, Xing-Min ; Li, Wang-Yun... - p. 1-4 , 2020
 
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5

Tensile performance of line-type microscale Cu/Sn-58Bi/Cu j..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Li, Xing-Min ; Gui, Jun ; Li, Wang-Yun... - p. 1-4 , 2020
 
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15

RAPD Analysis of Germplasm Resources of Kudingcha Species i..:

ZHENG, Dao-jun ; LIANG, Yuan-fa ; LIU, Gou-min...
Agricultural Sciences in China.  8 (2009)  7 - p. 784-792 , 2009
 
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