I agree that this site is using cookies. You can find further informations here.
X
Yang, Chih-Han
17209  results:
Search for persons X
?
1

Reducing anisotropy of rhombohedral Bi-rich phase for high-..:

Yang, Chih-han ; Liu, Yu-chen ; Nishikawa, Hiroshi.
Journal of Materials Research and Technology.  30 (2024)  - p. 16-24 , 2024
Link: https://doi.org/10.1016/..
 
?
2

Phase equilibria, thermodynamic assessment, and the mechani..:

Yang, Chih-han ; Wu, Fang-yao ; Lin, Shih-kang
Intermetallics.  165 (2024)  - p. 108148 , 2024
Link: https://doi.org/10.1016/..
 
?
3

How to enhance Sn-Bi low-temperature solder by alloying?:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Lin, Shih-Kang ; Yang, Chih-Han ; Liu, Yu-Chen.. - p. 53-54 , 2023
Link: https://doi.org/10.23919..
 
?
4

Effect of low Bi content on mechanical properties of Sn-Bi-..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Nishikawa, Hiroshi ; Hirata, Yuki ; Yang, Chih-han. - p. 383-386 , 2022
Link: https://doi.org/10.1109/..
 
?
5

Effect of Low Bi Content on Reliability of Sn-Bi Alloy Join..:

Nishikawa, Hiroshi ; Hirata, Yuki ; Yang, Chih-han.
JOM.  74 (2022)  4 - p. 1751-1759 , 2022
Link: https://doi.org/10.1007/..
 
?
6

Sn-based solder design using machine learning approach:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Liu, Yu-Chen ; Yang, Chih-Han ; Lin, Shih-Kang - p. 43-44 , 2022
Link: https://doi.org/10.23919..
 
?
7

High thermal stability Cu-to-Cu joints fabricated by using ..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Huang, Tzu-Hsuan ; Liu, Yu-Chen ; Cheng, Cheng-En... - p. 127-128 , 2022
Link: https://doi.org/10.23919..
 
?
8

Mechanical properties of Sn-Bi-Ag low-temperature Pb-free s..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Yang, Chih-Han ; Liu, Yu-Chen ; Hirata, Yuki.. - p. 37-38 , 2022
Link: https://doi.org/10.23919..
 
?
9

High-strength Sn–Bi-based low-temperature solders with high..:

Yang, Chih-han ; Liu, Yu-chen ; Hirata, Yuki..
Science and Technology of Welding and Joining.  27 (2022)  7 - p. 572-578 , 2022
Link: https://doi.org/10.1080/..
 
?
10

Improvements in mechanical properties of Sn–Bi alloys with ..:

Hirata, Yuki ; Yang, Chih-han ; Lin, Shih-kang.
Materials Science and Engineering: A.  813 (2021)  - p. 141131 , 2021
Link: https://doi.org/10.1016/..
 
?
11

Formation of a Diffusion Barrier-Like Intermetallic Compoun..:

Yang, Ting-Li ; Liu, Yu-chen ; Yang, Chih-han..
JOM.  72 (2020)  10 - p. 3538-3546 , 2020
Link: https://doi.org/10.1007/..
 
?
12

Accelerating Variant Calling with Parallelized DeepVariant:

, In: Proceedings of the International Conference on Research in Adaptive and Convergent Systems,
Yang, Chih-Han ; Zeng, Jhih-Wun ; Liu, Cheng-Yueh. - p. 13-18 , 2020
Link: https://dl.acm.org/doi/1..
 
?
13

A Computational Thermodynamics-Assisted Development of Sn-B..:

Yang, Chih-han ; Zhou, Shiqi ; Lin, Shih-kang.
Materials.  12 (2019)  4 - p. 631 , 2019
Link: https://doi.org/10.3390/..
 
?
14

The newly developed Sn–Bi–Zn alloy with a low melting point..:

Zhou, Shiqi ; Yang, Chih-han ; Shen, Yu-An..
Materialia.  6 (2019)  - p. 100300 , 2019
Link: https://doi.org/10.1016/..
 
?
15

Effects of Ti addition on the microstructure, mechanical pr..:

Zhou, Shiqi ; Yang, Chih-han ; Lin, Shih-kang...
Materials Science and Engineering: A.  744 (2019)  - p. 560-569 , 2019
Link: https://doi.org/10.1016/..
 
1-15