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Yang, Daoguo
175  results:
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1

Highly Stable Pin Pull Test Method for PCB Pad Cratering Ch..:

He, Hengjian ; Cai, Miao ; Yun, Minghui...
IEEE Transactions on Instrumentation and Measurement.  73 (2024)  - p. 1-8 , 2024
Link: https://doi.org/10.1109/..
 
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2

Aging and Sintered Layer Defect Detection of Discrete MOSFE..:

Yun, Minghui ; Yang, Daoguo ; Cai, Miao...
IEEE Transactions on Device and Materials Reliability.  24 (2024)  1 - p. 129-141 , 2024
Link: https://doi.org/10.1109/..
 
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3

Prediction of Packaging Induced-Warpage for a 3D Stacked Pa..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Han ; Qin, Junjie ; Wang, Guanglai... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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4

A Wire-less SiC Power Module Using Flip-Chip Sintering Meth..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Yuncan ; Yan, Haidong ; Yang, Daoguo... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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5

Thermal performance optimization analysis of double-sided h..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Chen, Shuaiyang ; Liu, Dongjing ; Li, Hao... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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6

Design and Integration Approach of Low-Inductance Vertical ..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Fan, Yinxiang ; Yan, Haidong ; Yang, Daoguo... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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7

The adsorption characteristics of MoS2–CuO heterojunction t..:

Xue, Shirui ; Huang, Zhaoling ; Yun, Minghui...
Applied Surface Science.  610 (2023)  - p. 155564 , 2023
Link: https://doi.org/10.1016/..
 
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8

Molecular dynamics simulation of copper paste sintering for..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Luo, Yinyin ; Cai, Miao ; He, Siliang... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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9

Low‐Temperature Solidifiable Liquid Metal with Ultrahigh Th..:

Zheng, Zenghuang ; Wei, Song ; Yang, Yiren...
Advanced Engineering Materials.  25 (2023)  11 - p. , 2023
Link: https://doi.org/10.1002/..
 
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10

Thermal-mechanical Reliability and Package Optimization of ..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Ma, Yufeng ; Wang, Zijian ; Zhu, Cheng... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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11

A Novel Band-pass Filter in Ka Band with SiP Packaging:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Qin, Junjie ; Wang, Han ; Chen, Danyang... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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12

Investigation on the effect of the packaging-induced stress..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Chen, Danyang ; Ni, Yan ; Wang, Han... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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13

Warpage Analysis and Optimization of Fan-Out Panel-Level Pa..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Zijian ; Yang, Wen ; Zhu, Cheng... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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14

Thermal characteristics analysis and optimization of 3D-Sta..:

, In: 2022 19th China International Forum on Solid State Lighting & 2022 8th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS),
Cao, Fengzhe ; Yang, Wen ; Yun, Minghui. - p. 121-124 , 2023
Link: https://doi.org/10.1109/..
 
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15

Characterization and modeling of interface delamination in ..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zhu, Cheng ; Yang, Wen ; Chen, Danyang... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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