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2024 International Conference on Electronics Packaging (ICEP) ,
1
Investigation of Wafer Warpage Evolution Baesd on Fan-Out C..:
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2023 International Conference on Electronics Packaging (ICEP) ,
2
Post-Buckling Analysis for Addressing Asymmetric Warping of..:
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2023 IEEE CPMT Symposium Japan (ICSJ) ,
3
Board-Level Drop Reliability Analysis for Fine-Pitch BGA Pa..:
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2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
8
A Cyclic-Softening Viscoplastic Model for Considering the T..:
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2024 International Conference on Artificial Intelligence in Information and Communication (ICAIIC) ,
14
Intuitive, Interactive Training System for the Sense of Sou..:
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2022 IEEE International Conference on Artificial Intelligence in Engineering and Technology (IICAIET) ,
15