Yang, Hung-Chun
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1

Investigation of Wafer Warpage Evolution Baesd on Fan-Out C..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Yang, Hung-Chun ; Lai, Wei-Hong ; Kao, Chin-Li.. - p. 151-152 , 2024
 
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2

Post-Buckling Analysis for Addressing Asymmetric Warping of..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Chen, Chia-Yu ; Lee, Yu-Ching ; Chen, Kuo-Shen... - p. 265-266 , 2023
 
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8

A Cyclic-Softening Viscoplastic Model for Considering the T..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Yang, Hung-Chun ; Chiu, Tz-Cheng - p. 157-160 , 2020
 
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10

A power-saving data storage scheme for wireless sensor netw..:

Liao, Wen-Hwa ; Yang, Hung-Chun
Journal of Network and Computer Applications.  35 (2012)  2 - p. 818-825 , 2012
 
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11

Reliability model for bridging failure of Pb-free ball grid..:

Chiu, Tz-Cheng ; Lin, Jyun-Ji ; Yang, Hung-Chun.
Microelectronics Reliability.  50 (2010)  12 - p. 2037-2050 , 2010
 
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14

Intuitive, Interactive Training System for the Sense of Sou..:

, In: 2024 International Conference on Artificial Intelligence in Information and Communication (ICAIIC),
Lin, Tsen-Fang ; Yang, Chun-Hung - p. 108-111 , 2024
 
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15

Computer-assisted Table Tennis Posture Analysis using Machi..:

, In: 2022 IEEE International Conference on Artificial Intelligence in Engineering and Technology (IICAIET),
 
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