E-LIB Suche - Ergebnisse für: Yang, Ji Chul

1

Post Cleaning for FEOL CMP with Silica and Ceria Slurries:

Tseng, Wei-Tsu ; Jha, Amarnath ; Stoll, Derek...
ECS Transactions. 80 (2017) 2 - p. 91-99 , 2017

2

Post Cleaning for FEOL CMP with Silica and Ceria Slurries:

Tseng, Wei-Tsu ; Wu, Changhong ; McCormack, Tim.
ECS Journal of Solid State Science and Technology. 6 (2017) 10 - p. P718-P722 , 2017

Link: https://doi.org/10.1149/..

3

Study of sol-gel type ceria particle for CMP process in lea..:

, In: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),

Penigalapati, Dinesh Kumar ; Yang, Ji Chul ; Jha, Amarnath.. - p. 323-326 , 2017

Link: https://doi.org/10.1109/..

4

The Role of Polysilicon Slurry and Its Application in 7nm C..:

Chao, Tai Fong ; Penigalapati, Dinesh ; Yang, JI Chul..
ECS Transactions. 77 (2017) 5 - p. 227-233 , 2017

Link: https://doi.org/10.1149/..

5

Effective surface design for reduced scratches on CMP:

, In: Proceedings of International Conference on Planarization/CMP Technology 2014,

Yang, Ji Chul ; Scheffler, Daniel ; Moon, Yong Sik - p. 151-151 , 2014

Link: https://doi.org/10.1109/..

6

Investigation on the control of silicon whisker generation ..:

Choi, Hoomi ; Oh, Myeonghun ; Kim, Jinsung...
Thin Solid Films. 521 (2012) - p. 201-205 , 2012

Link: https://doi.org/10.1016/..

7

Frictional Characteristic of Polymeric Additive for the Slu..:

Kim, Hojoong ; Yang, Ji Chul ; Lee, Junwye...
ECS Journal of Solid State Science and Technology. 1 (2012) 3 - p. P101-P106 , 2012

Link: https://doi.org/10.1149/..

8

Experimental Evaluation of the Effect of Pad Debris Size on..:

Yang, Ji Chul ; Kim, Hojoong ; Oh, Dong Won...
Journal of Electronic Materials. 42 (2012) 1 - p. 97-102 , 2012

Link: https://doi.org/10.1007/..

9

Step height removal mechanism of chemical mechanical planar..:

Yang, Ji Chul ; Oh, Dong Won ; Lee, Gae Won..
Wear. 268 (2010) 3-4 - p. 505-510 , 2010

Link: https://doi.org/10.1016/..

10

Measurement of CMP Slurry Abrasive Size Distribution by Sca..:

Kim, Hojoong ; Yang, Ji Chul ; Kim, Taesung
Electrochemical and Solid-State Letters. 13 (2010) 4 - p. H137 , 2010

Link: https://doi.org/10.1149/..

11

Investigation on Surface Hardening of Polyurethane Pads Dur..:

Yang, Ji Chul ; Oh, Dong Won ; Kim, Ho Joong.
Journal of Electronic Materials. 39 (2010) 3 - p. 338-346 , 2010

Link: https://doi.org/10.1007/..

12

Effects of diamond size of CMP conditioner on wafer removal..:

Chul Yang, Ji ; Hoon Choi, Joo ; Hwang, Taewook..
International Journal of Machine Tools and Manufacture. 50 (2010) 10 - p. 860-868 , 2010

Link: https://doi.org/10.1016/..

13

Micro/nano-tribological characteristics of self-assembled m..:

Sung, In-Ha ; Yang, Ji-Chul ; Kim, Dae-Eun.
Wear. 255 (2003) 7-12 - p. 808-818 , 2003

Link: https://doi.org/10.1016/..

14

Oxygen vacancy engineering for tuning the catalytic activit..:

Cho, JeongHyun ; Kim, Minjae ; Yang, Inchan...
Journal of Rare Earths. 42 (2024) 3 - p. 506-514 , 2024

Link: https://doi.org/10.1016/..

15

Lanthanum oxide-based nanomaterials synthesized by using ca..:

Kim, Taeyeon ; Lee, Junsoo ; Yang, Inchan...
Applied Surface Science. 610 (2023) - p. 155424 , 2023

Link: https://doi.org/10.1016/..