Yang, Ping-Feng
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1

Approach with Large Panel Fan-Out Technology:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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2

Application of the Taguchi method to minimize the non-unifo..:

Yu, Shun-Hsuan ; Kao, Chuan-Ping ; Ma, Chun-Wei...
Journal of the Taiwan Institute of Chemical Engineers.  156 (2024)  - p. 105379 , 2024
 
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3

Preparation and Characterization of Expanded Graphite/Polym..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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5

Deca & ASE M-Series Bridge Die Compensation & Adaptive Patt..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Sandstrom, Clifford ; Talain, Erick ; Olson, Timothy... - p. 797-803 , 2023
 
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6

The physical improvement of copper deposition uniformity wi..:

Ma, Chun-Wei ; Yu, Shun-Hsuan ; Fang, Jen-Kuang..
Journal of Electroanalytical Chemistry.  948 (2023)  - p. 117790 , 2023
 
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7

Mask-less Laser Direct Imaging & Adaptive Patterning Soluti..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
 
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8

Interconversions between linear viscoelastic functions with..:

Chen, Dao-Long ; Chiu, Tz-Cheng ; Chen, Tei-Chen..
Mathematics and Mechanics of Solids.  23 (2017)  6 - p. 879-895 , 2017
 
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9

Rice husk agricultural waste-derived low ionic content carb..:

Hsieh, Ya-Yu ; Tsai, Yun-Chih ; He, Jia-Rung...
Journal of the Taiwan Institute of Chemical Engineers.  78 (2017)  - p. 493-499 , 2017
 
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15

Silane modification on mesoporous silica coated carbon nano..:

Chung, Min-Hua ; Wang, Wei-Hsiang ; Chen, Li-Ming...
Composites Part A: Applied Science and Manufacturing.  78 (2015)  - p. 1-9 , 2015
 
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