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Yang, Shih-Chi
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1

Electromigration Failure Mechanisms of Cu-Cu Joints at Low ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yang, Shih-Chi ; Chen, Chih - p. 665-669 , 2024
Link: https://doi.org/10.1109/..
 
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2

Low-Temperature Cu-Cu Bonding Using -oriented and Nanocryst..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, Chen-Ning ; Ong, Jia-Juen ; Chiu, Wei-Lan... - p. 1312-1316 , 2024
Link: https://doi.org/10.1109/..
 
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3

Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hy..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Yu-An ; Ong, Jia-Juen ; Chiu, Wei-Lan... - p. 399-403 , 2024
Link: https://doi.org/10.1109/..
 
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4

Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Yang, Shih-Chi ; Ong., Jia-Juen ; Tran, Dinh-Phuc... - p. 13-14 , 2023
Link: https://doi.org/10.23919..
 
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5

Periodic reverse electrodeposition of (1 1 1)-oriented nano..:

Yang, Shih-Chi ; Tran, Dinh-Phuc ; Ong, Jia-Juen...
Journal of Electroanalytical Chemistry.  935 (2023)  - p. 117328 , 2023
Link: https://doi.org/10.1016/..
 
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6

To suppress thermomigration of Cu–Sn intermetallic compound..:

Huang, Yan-Rong ; Tran, Dinh-Phuc ; Hsu, Po-Ning...
Journal of Materials Research and Technology.  24 (2023)  - p. 7910-7924 , 2023
Link: https://doi.org/10.1016/..
 
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7

Potassium hydroxide surface modification for low temperatur..:

Ong, Jia-Juen ; Tran, Dinh-Phuc ; Chiu, Wei-Lan...
Surfaces and Interfaces.  40 (2023)  - p. 103076 , 2023
Link: https://doi.org/10.1016/..
 
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8

High Temperature Storage of Cu-Cu Joints Fabricated by High..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Yang, Shih-Chi ; Chen, Chih - p. 2075-2078 , 2023
Link: https://doi.org/10.1109/..
 
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9

Passivation of positively charged cationic defects in perov..:

Yang, Yuxuan ; Zhao, Tao ; Li, Ming-Hua...
Chemical Engineering Journal.  451 (2023)  - p. 138962 , 2023
Link: https://doi.org/10.1016/..
 
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10

Recrystallization and Grain Growth in Cu-Cu Joints under El..:

Yang, Shih-Chi ; Tran, Dinh-Phuc ; Chen, Chih
Materials.  16 (2023)  17 - p. 5822 , 2023
Link: https://doi.org/10.3390/..
 
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11

Stress Relaxation and Grain Growth Behaviors of (111)-Prefe..:

Lai, Jyun-Yu ; Tran, Dinh-Phuc ; Yang, Shih-Chi...
Nanomaterials.  13 (2023)  4 - p. 709 , 2023
Link: https://doi.org/10.3390/..
 
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12

Low temperature Cu/SiO2 hybrid bonding via 〈1 1 1〉-oriented..:

Yu, Min-Hsun ; Ong, Jia-Juen ; Tran, Dinh-Phuc...
Applied Surface Science.  636 (2023)  - p. 157854 , 2023
Link: https://doi.org/10.1016/..
 
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13

Silver‐Alloyed Low‐Bandgap CuInSe2 Solar Cells for Tandem A..:

Krause, Maximilian ; Yang, Shih-Chi ; Moser, Simon...
Solar RRL.  7 (2023)  9 - p. , 2023
Link: https://doi.org/10.1002/..
 
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14

Measurement of Thermal Stress by X-ray Nano-Diffraction in ..:

Hsu, Wei-You ; Yang, Shih-Chi ; Lin, You-Yi...
Nanomaterials.  13 (2023)  17 - p. 2448 , 2023
Link: https://doi.org/10.3390/..
 
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15

Single-crystal-like Cu joints with high strength and resist..:

Ong, Jia-Juen ; Tran, Dinh-Phuc ; Lin, You-Yi...
Materials Science and Engineering: A.  857 (2022)  - p. 144051 , 2022
Link: https://doi.org/10.1016/..
 
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