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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Characteristics and Reliability of Al and Al-coated Cu Wire..:
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
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Application of AI-enabled Simulation in Power Package Devel..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
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AI-enabled Automatic Molding Compound Selection for A Power..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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