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Yao, Quanbin
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1

Transient liquid phase bonding of Sn-Pb solder with added C..:

Wang, Jiaxing ; Lin, Pengrong ; Yao, Quanbin...
Journal of Physics: Conference Series.  2671 (2024)  1 - p. 012022 , 2024
Link: https://doi.org/10.1088/..
 
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2

Study on mechanical properties and microstructure reliabili..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Jiaxing ; Zhang, Long ; Yao, Quanbin... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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3

Effect of insulating material and structure on the reliabil..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Li, Zongyang ; Yao, Quanbin ; Lin, Pengrong... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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4

Simulation analysis of a specification package for high den..:

Cai, Jiawei ; Zhang, Long ; Huang, Yingzhuo..
Journal of Physics: Conference Series.  2383 (2022)  1 - p. 012093 , 2022
Link: https://doi.org/10.1088/..
 
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5

Transient liquid phase bonding of Sn-Pb solder with added N..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Jiaxing ; Yao, Quanbin ; Lin, Pengrong... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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6

Interface mechanical behavior of gold alloy wire bonding:

Xie, Shuang ; Lin, Pengrong ; Yao, Quanbin
Journal of Physics: Conference Series.  1907 (2021)  1 - p. 012021 , 2021
Link: https://doi.org/10.1088/..
 
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7

Submodelling method for modelling and simulation of high-de..:

Kong, Lingsong ; Yao, Quanbin ; Lv, Xiaorui.
Journal of Physics: Conference Series.  1633 (2020)  1 - p. 012054 , 2020
Link: https://doi.org/10.1088/..
 
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8

The Mechanical Analysis of Sn-Base Bump:

Yang, Jun ; Yao, Quanbin ; Lin, Pengrong..
IOP Conference Series: Materials Science and Engineering.  612 (2019)  5 - p. 052042 , 2019
Link: https://doi.org/10.1088/..
 
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9

Overview of the assembly and packaging of wide band gap sem..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Zhao, Wenzhong ; Yao, Quanbin - p. 1229-1232 , 2017
Link: https://doi.org/10.1109/..
 
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10

The finite element analysis on reliability of gold bump:

, In: 2016 17th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Jiansong ; Yao, Quanbin ; Lin, Pengrong.. - p. 1330-1333 , 2016
Link: https://doi.org/10.1109/..
 
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11

Electrical simulation of gold bonding wire with different p..:

, In: 2015 16th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Dejing ; Zhao, Yuanfu ; Yao, Quanbin... - p. 1329-1333 , 2015
Link: https://doi.org/10.1109/..
 
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12

Research on Thermal Resistance Test Method of Stacked Packa..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Jiawei, Cai ; Xiaorui, Lv ; Pengrong, Lin.. - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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13

Fluoride-Salt-cooled high-Temperature Advanced Reactor (FuS..:

Zhang, Dalin ; Li, Xinyu ; Jiang, Dianqiang...
Energy.  290 (2024)  - p. 130048 , 2024
Link: https://doi.org/10.1016/..
 
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14

Comparative study on ventilation and air conditioning syste..:

Cao, Weixue ; Zhang, Xudong ; Yao, Wanxiang...
Aerobiologia.  39 (2023)  4 - p. 429-439 , 2023
Link: https://doi.org/10.1007/..
 
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15

Exosome-coated polydatin nanoparticles in the treatment of ..:

Chen, Qiu ; Yao, Lei ; Liu, Quanbin...
Aging.  15 (2023)  14 - p. 6905-6920 , 2023
Link: https://doi.org/10.18632..
 
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