Yeh, Sheng-Kai
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3

Environmental Sensing Hub on Single Chip Using Double-Side ..:

, In: 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS),
Chang, Cheng-Chun ; Hong, Ping-Hsiu ; Yeh, Sheng-Kai... - p. 877-880 , 2020
 
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Monolithic Integration of Pressure/Humidity/Temperature Sen..:

, In: 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS),
 
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6

Vertically Integrated Double-Bridge Design for CMOS-MEMS Tr..:

, In: 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS),
Lee, Jia-Horng ; Yeh, Sheng-Kai ; Fang, Weileun - p. 693-696 , 2020
 
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Flip-Chip Integration of Inductive CMOS Tactile Sensor with..:

, In: 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS),
Yeh, Sheng-Kai ; Fang, Weileun - p. 833-836 , 2019
 
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Monolithic/Vertical Integration of Piezo-Resistive Tactile ..:

, In: 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS),
Lee, Jia-Horng ; Yeh, Sheng-Kai ; Fang, Weileun - p. 826-829 , 2019
 
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Development of CMOS MEMS inductive type tactile sensor with..:

Yeh, Sheng-Kai ; Chang, Heng-Chung ; Fang, Weileun
Journal of Micromechanics and Microengineering.  28 (2018)  4 - p. 044005 , 2018
 
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