E-LIB Suche - Ergebnisse für: Yen, Yee Wen

1

Isothermal Section of the Sn-Fe-Zn Ternary System at 270°C:

Yen, Yee Wen ; Hsieh, Yu Pin ; Chen, Wan Ching.
Applied Mechanics and Materials. 284-287 (2013) - p. 152-157 , 2013

Link: https://doi.org/10.4028/..

2

Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0...:

Laksono, Andromeda Dwi ; Shen, Yu-An ; Chen, Ting.
JOM. 76 (2024) 6 - p. 2754-2762 , 2024

Link: https://doi.org/10.1007/..

3

Effects of Minor Ga Addition on Interfacial Reactions Betwe..:

Wang, Chao-hong ; Li, Kuan-ting ; Yen, Yee-wen
JOM. 76 (2024) 6 - p. 2731-2740 , 2024

Link: https://doi.org/10.1007/..

4

Solid/solid state interfacial reactions in the lead-free so..:

Yen, Yee-Wen ; Laksono, Andromeda Dwi ; Liou, Yi-Chin...
Journal of the Taiwan Institute of Chemical Engineers. 155 (2024) - p. 105278 , 2024

Link: https://doi.org/10.1016/..

5

Comparative Study of the Impurity Effect on SnAgCu and SnZn..:

Li, Yu-Ju ; Yen, Yee-Wen ; Chen, Chih-Ming
Materials. 17 (2024) 9 - p. 2149 , 2024

Link: https://doi.org/10.3390/..

6

Investigation of the Interfacial Reactions between the CoCu..:

Chiang, Tzu-Yang ; Chang, Yong-Chi ; Wang, Chao-Hong..
Metals. 13 (2023) 4 - p. 710 , 2023

Link: https://doi.org/10.3390/..

7

Phase Equilibria of the Ag-Al-Au Ternary System and Interfa..:

Ramadhani, Mavindra ; Laksono, Andromeda Dwi ; Liang, Chien-Lung...
Materials. 16 (2023) 22 - p. 7196 , 2023

Link: https://doi.org/10.3390/..

8

Development of High Temperature Lead-free Solders in the Al..:

, In: 2023 International Conference on Electronics Packaging (ICEP),

Laksono, Andromeda Dwi ; Yen, Yee-Wen - p. 197-198 , 2023

Link: https://doi.org/10.23919..

9

Solid/Solid State Interfacial Reactions in the Sn-9Zn/Cu-Ba..:

Laksono, Andromeda Dwi ; Al-Audhah, Lutfi Yunus Wahab ; Chen, Chih-Ming..
JOM. 75 (2023) 6 - p. 1889-1901 , 2023

Link: https://doi.org/10.1007/..

10

Preparation of ZnO/NiO-loaded flexible cellulose nanofiber ..:

Gemeda, Getachew Feyissa ; Etefa, Habtamu Fekadu ; Hsieh, Chin-Chih...
Carbohydrate Polymer Technologies and Applications. 3 (2022) - p. 100213 , 2022

Link: https://doi.org/10.1016/..

11

Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C1..:

Laksono, Andromeda Dwi ; Tsai, Tzu-Yang ; Chung, Tai-Hsuan..
Metals. 13 (2022) 1 - p. 12 , 2022

Link: https://doi.org/10.3390/..

12

Investigation of phase equilibria of the Au–Ni–Sn ternary s..:

Yang, Chiao-Yi ; Laksono, Andromeda Dwi ; Yen, Yee-Wen...
Materials Chemistry and Physics. 289 (2022) - p. 126494 , 2022

Link: https://doi.org/10.1016/..

13

Study on Interfacial Reactions and Tensile Properties in th..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),

Laksono, Andromeda Dwi ; Chou, Jing-Ting ; Chiang, Tzu-Yang. - p. 1-4 , 2022

Link: https://doi.org/10.1109/..

14

Influences of Impurity Incorporation in Electroplated Cu on..:

Chen, Po-Kai ; Li, Yu-Ju ; Yen, Yee-Wen.
Journal of The Electrochemical Society. 169 (2022) 5 - p. 052508 , 2022

Link: https://doi.org/10.1149/..

15

The roles of plasma science towards plasma-activated reflow..:

Kencana, Sagung Dewi ; Kuo, Yu-Lin ; Yen, Yee-Wen..
Surfaces and Interfaces. 34 (2022) - p. 102284 , 2022

Link: https://doi.org/10.1016/..