E-LIB Suche - Ergebnisse für: Yin, Huaxiang

1

New structure transistors for advanced technology node CMOS..:

Zhang, Qingzhu ; Zhang, Yongkui ; Luo, Yanna.
National Science Review. 11 (2024) 3 - p. , 2024

Link: https://doi.org/10.1093/..

2

Demonstration of EOT-Scaled FinFET Based on Thickness-Propo..:

Zhong, Kun ; Zhang, Fan ; Zhang, Zhaohao...
IEEE Electron Device Letters. , 2024

Link: https://doi.org/10.1109/..

3

Partially Isolated Dual Work Function Gate IGZO TFT With Ob..:

Bao, Yunjiao ; Yan, Gangping ; Cao, Lei...
IEEE Journal of the Electron Devices Society. , 2024

Link: https://doi.org/10.1109/..

4

Interface Treatment of Epitaxial SI FINFET Channel in Repla..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),

Jiang, Renjie ; Cao, Lei ; Xiong, Wenjuan... - p. 1-3 , 2024

Link: https://doi.org/10.1109/..

5

Investigation of Electrical Characteristics of a Fabricated..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),

Lu, Yupeng ; Sun, Peng ; Yan, Gangping... - p. 1-3 , 2024

Link: https://doi.org/10.1109/..

6

Impact of Thickness Dependent Ferroelectric and Interface C..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),

Zhang, Fan ; Zhang, Zhaohao ; Huo, Jiali... - p. 1-3 , 2024

Link: https://doi.org/10.1109/..

7

Performance improvements in complementary metal oxide semic..:

Zhang, Zhao-Hao ; Luo, Yan-Na ; Xu, Gao-Bo...
Rare Metals. 43 (2024) 7 - p. 3242-3249 , 2024

Link: https://doi.org/10.1007/..

8

Virtual FAB Semiconductor Process Modeling Augmented Vertic..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),

Di, Zhaohai ; Luo, Yanna ; Xu, Haoqing... - p. 1-3 , 2024

Link: https://doi.org/10.1109/..

9

Low Temperature (Down to 6 K) and Quantum Transport Charact..:

Zhu, Xiaohui ; Cao, Lei ; Wang, Guilei.
Nanomaterials. 14 (2024) 11 - p. 916 , 2024

Link: https://doi.org/10.3390/..

10

Unique Consecutive RTN Characteristics Coupled With Ferroel..:

Zhang, Fan ; Yang, Hong ; Zhang, Qingzhu...
IEEE Electron Device Letters. 45 (2024) 4 - p. 566-569 , 2024

Link: https://doi.org/10.1109/..

11

Reversible and Irreversible Polarization Degradation of Hf0..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),

Gao, Zhaomeng ; Xin, Tianjiao ; Liu, Cheng... - p. 1-5 , 2024

Link: https://doi.org/10.1109/..

12

Ultrasensitive 3D Stacked Silicon Nanosheet Field-Effect Tr..:

Li, Yinglu ; Wei, Shuhua ; Xiong, Enyi...
Biosensors. 14 (2024) 3 - p. 144 , 2024

Link: https://doi.org/10.3390/..

13

Improvement of Line Roughness of Fin by Conventional Therma..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),

Wang, Peng ; Sang, Guanqiao ; Lu, Yihong... - p. 1-3 , 2024

Link: https://doi.org/10.1109/..

14

The Investigation of Reduced Variation Effect in FinFETs Wi..:

Zhang, Fan ; Zhang, Zhaohao ; Yao, Jiaxin...
IEEE Transactions on Electron Devices. 71 (2024) 5 - p. 2876-2880 , 2024

Link: https://doi.org/10.1109/..

15

Sub-5-Å La2O3 In Situ Dipole Technique for Large VFB Modula..:

Wei, Yanzhao ; Yao, Jiaxin ; Zhang, Qingzhu...
IEEE Transactions on Electron Devices. 71 (2024) 1 - p. 746-751 , 2024

Link: https://doi.org/10.1109/..