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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Evaluation of Vapor Pressure Induced Debonding Failure in F..:
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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Micro-Defect Failure Analysis in Fan-Out Package and Corres..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Reliability Prediction and Improvement of Board-Level Therm..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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A Quantitative Evaluation of the Inelastic Energy Absorptio..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Development and Application of the Moisture-Dependent Visco..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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