Yin, Wei-Jie
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1

Evaluation of Vapor Pressure Induced Debonding Failure in F..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Bo-Shuo ; Chiu, Tz-Cheng ; Yin, Wei-Jie.. - p. 150-156 , 2024
 
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2

Micro-Defect Failure Analysis in Fan-Out Package and Corres..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chang, Yu-Jen ; Hsiao, Yu-Hsiang ; Lin, Yi-Sheng. - p. 327-329 , 2023
 
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3

Reliability Prediction and Improvement of Board-Level Therm..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chen, Dao-Long ; Chen, Tang-Yuan ; Lai, Wei-Hong... - p. 995-998 , 2023
 
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4

A Quantitative Evaluation of the Inelastic Energy Absorptio..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Chien-Yu ; Chiu, Tz-Cheng ; Yin, Wei-Jie... - p. 721-726 , 2023
 
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5

Development and Application of the Moisture-Dependent Visco..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Yang, Chia-Ming ; Chiu, Tz-Cheng ; Yin, Wei-Jie... - p. 746-753 , 2022
 
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6

Mechanical and Thermal Characterization Analysis of Chip-la..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Yin, Wei-Jie ; Lai, Wei-Hong ; Lu, Ying-Xu... - p. 1711-1719 , 2022
 
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8

A High Performance Ni-Free Redox Reversible Ceramic Anode R..:

Xu, Ze ; Yin, Yi-Mei ; Lu, Jun...
Journal of The Electrochemical Society.  163 (2016)  7 - p. F737-F743 , 2016
 
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10

Structure and Properties of Novel Cobalt-Free Oxides NdxSr1..:

Yin, Jie-Wei ; Yin, Yi-Mei ; Lu, Jun...
The Journal of Physical Chemistry C.  118 (2014)  25 - p. 13357-13368 , 2014
 
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11

Nd 0.5 Sr 0.5 Fe 0.8 Cu 0.2 O 3−δ – x Sm 0.2 Ce 0.8 O 1.9 c..:

Yin, Jie-Wei ; Yin, Yi-Mei ; Lu, Jun...
International Journal of Hydrogen Energy.  39 (2014)  31 - p. 17852-17856 , 2014
 
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