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Yong-huan Guo
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1

Multi-objective optimization of laser welding parameters fo..:

Zhu, Zhi-wei ; Guo, Yong-huan ; Zhang, Xin-ran..
Welding in the World.  68 (2024)  5 - p. 1271-1279 , 2024
Link: https://doi.org/10.1007/..
 
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2

Correction: Multi-objective optimization of laser welding p..:

Zhu, Zhi-wei ; Guo, Yong-huan ; Zhang, Xin-ran..
Welding in the World.  , 2024
Link: https://doi.org/10.1007/..
 
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3

Intermetallic compound evolution and mechanical properties ..:

Chen, Chen ; Zhang, Liang ; Wang, Xi..
Journal of Materials Research and Technology.  24 (2023)  - p. 3643-3656 , 2023
Link: https://doi.org/10.1016/..
 
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4

Microstructure evolution and thermal, wetting, mechanical p..:

Lu, Xiao ; Zhang, Liang ; Guo, Yong-huan...
Intermetallics.  154 (2023)  - p. 107816 , 2023
Link: https://doi.org/10.1016/..
 
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5

Ultrasonic-assisted connection of Cu/Cu structure using Sn5..:

Chen, Chen ; Zhang, Liang ; Wang, Xi..
Journal of Materials Processing Technology.  319 (2023)  - p. 118062 , 2023
Link: https://doi.org/10.1016/..
 
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6

Mechanical properties and microstructure evolution of Cu/Sn..:

Chen, Chen ; Zhang, Liang ; Wang, Xi...
Journal of Materials Research and Technology.  23 (2023)  - p. 1225-1238 , 2023
Link: https://doi.org/10.1016/..
 
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7

Study on the dual inhibition behavior of interfacial IMCs i..:

Lu, Xiao ; Zhang, Liang ; Guo, Yong-huan...
Journal of Materials Research and Technology.  25 (2023)  - p. 3754-3767 , 2023
Link: https://doi.org/10.1016/..
 
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8

Microstructure and properties of Sn58Bi/Ni solder joint mod..:

Chen, Chen ; Zhang, Liang ; Wang, Xi..
Journal of Materials Research and Technology.  24 (2023)  - p. 514-526 , 2023
Link: https://doi.org/10.1016/..
 
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9

Growth behavior and reliability of interfacial IMC for Sn58..:

Wang, Xi ; Zhang, Liang ; Wang, Xiao...
Journal of Materials Research and Technology.  21 (2022)  - p. 4263-4280 , 2022
Link: https://doi.org/10.1016/..
 
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10

The analysis of the fracture mechanism of thermal simulatio..:

Yan, Tian ; Guo, Yong-huan ; Fan, Xi-ying...
Welding in the World.  65 (2021)  4 - p. 563-572 , 2021
Link: https://doi.org/10.1007/..
 
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11

Materials, processing and reliability of low temperature bo..:

Zhang, Liang ; Liu, Zhi-quan ; Chen, Sinn-Wen...
Journal of Alloys and Compounds.  750 (2018)  - p. 980-995 , 2018
Link: https://doi.org/10.1016/..
 
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12

Wettability optimization analysis of lead-free solders with..:

Zhang, Liang ; Sun, Lei ; Han, Ji-guang.
Journal of Materials Science: Materials in Electronics.  26 (2015)  4 - p. 2605-2608 , 2015
Link: https://doi.org/10.1007/..
 
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13

Sizes effect of CeSn3 on the whiskers growth of SnAgCuCe so..:

Zhang, Liang ; Sun, Lei ; Han, Ji-guang.
Journal of Materials Science: Materials in Electronics.  26 (2015)  8 - p. 6194-6197 , 2015
Link: https://doi.org/10.1007/..
 
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14

Creep behavior of SnAgCu solders containing nano-Al particl..:

Zhang, Liang ; Han, Ji-guang ; Guo, Yong-huan.
Journal of Materials Science: Materials in Electronics.  26 (2015)  6 - p. 3615-3620 , 2015
Link: https://doi.org/10.1007/..
 
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15

Forecasting of mechanical properties of covered electrode c..:

Xu, Yi-Jun ; Guo, Yong-Huan ; Fan, Hui
Rare Metals.  37 (2015)  2 - p. 161-166 , 2015
Link: https://doi.org/10.1007/..
 
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