E-LIB Suche - Ergebnisse für: Yoon, Jeong-Won

1

Optimization of TLPS Bonding Process and Joint Property usi..:

Han, Da-Gyeong ; Lee, Dong-Hwan ; Yoon, Jeong-Won
Journal of Welding and Joining. 42 (2024) 2 - p. 165-173 , 2024

2

Evaluation of high-temperature long-term reliability of tra..:

Heo, Min-Haeng ; Seo, Young-Jin ; Yoon, Jeong-Won
Journal of Materials Science: Materials in Electronics. 35 (2024) 19 - p. , 2024

Link: https://doi.org/10.1007/..

3

A comparative study of laser soldering and reflow soldering..:

Jeong, Min-Seong ; Heo, Min-Haeng ; Kim, Jungsoo.
Journal of Materials Science: Materials in Electronics. 34 (2023) 28 - p. , 2023

Link: https://doi.org/10.1007/..

4

Microstructures and mechanical properties of ENIG/Sn-3.5Ag/..:

Kim, Hyeon-Tae ; Yoon, Jeong-Won
Journal of Materials Research and Technology. 24 (2023) - p. 4468-4483 , 2023

Link: https://doi.org/10.1016/..

5

Novel and fast transient liquid phase bonding using etched ..:

Heo, Min-Haeng ; Seo, Young-Jin ; Yoon, Jeong-Won
Materials Today Communications. 35 (2023) - p. 105730 , 2023

Link: https://doi.org/10.1016/..

6

Microstructures and mechanical properties of ultrasonic-wel..:

Kim, Hyeon-Tae ; Yoon, Jeong-Won
Journal of Materials Science: Materials in Electronics. 34 (2023) 29 - p. , 2023

Link: https://doi.org/10.1007/..

7

Transient liquid phase bonding using Cu foam and Cu–Sn past..:

Heo, Min-Haeng ; Seo, Young-Jin ; Yoon, Jeong-Won
Journal of Materials Research and Technology. 27 (2023) - p. 2856-2867 , 2023

Link: https://doi.org/10.1016/..

8

Comparative study of solder size and volume effect on prope..:

Seo, Young-Jin ; Heo, Min-Haeng ; Noh, Eun-Chae.
Journal of Materials Science: Materials in Electronics. 34 (2023) 16 - p. , 2023

Link: https://doi.org/10.1007/..

9

Comparative study of laser- and reflow-soldered Sn–3.0Ag–0...:

Lee, Dong-Hwan ; Jeong, Min-Seong ; Yoon, Jeong-Won
Journal of Materials Science: Materials in Electronics. 34 (2023) 3 - p. , 2023

Link: https://doi.org/10.1007/..

10

Effects of solder ball size and reflow cycles on properties..:

Noh, Eun-Chae ; Seo, Young-Jin ; Yoon, Jeong-Won
Journal of Materials Science: Materials in Electronics. 34 (2023) 33 - p. , 2023

Link: https://doi.org/10.1007/..

11

Comparative study of interfacial reaction and bonding prope..:

Lee, Dong-Hwan ; Jeong, Min-Seong ; Yoon, Jeong-Won
Journal of Materials Science: Materials in Electronics. 33 (2022) 10 - p. 7983-7994 , 2022

Link: https://doi.org/10.1007/..

12

Effects of shear test temperatures and conditions on mechan..:

Heo, Min-Haeng ; Lee, Dong-Hwan ; Jeong, Min-Seong.
Journal of Materials Science: Materials in Electronics. 33 (2022) 13 - p. 10002-10012 , 2022

Link: https://doi.org/10.1007/..

13

Effects of solder volume and size on microstructures and me..:

Seo, Young-Jin ; Yoon, Jeong-Won
Journal of Materials Science: Materials in Electronics. 33 (2022) 20 - p. 16700-16709 , 2022

Link: https://doi.org/10.1007/..

14

Recent Studies of Transient Liquid Phase Bonding Technology..:

Lee, Dong-Hwan ; Heo, Min-Haeng ; Yoon, Jeong-Won
Journal of Welding and Joining. 40 (2022) 3 - p. 233-241 , 2022

Link: https://doi.org/10.5781/..

15

Intermetallic compound transformation and mechanical streng..:

Jeong, So-Eun ; Yoon, Jeong-Won
Journal of Materials Science: Materials in Electronics. 33 (2022) 9 - p. 6616-6626 , 2022

Link: https://doi.org/10.1007/..