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2023 China Semiconductor Technology International Conference (CSTIC) ,
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Faster AU-AL IMC Growth Under Chlorine Environment:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Effects of temperature and electrical bias on Cu-Al IMCs gr..:
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2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Study of moisture penetration in chip passivation layer by ..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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Study of moisture penetration in polymer encapsulant by deu..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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Studies of Electron Backscattered Diffraction (EBSD) Analys..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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Chlorine and sulfur effects on copper-aluminum wire bond re..:
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2020 China Semiconductor Technology International Conference (CSTIC) ,
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Enhancing High Temperature Adhesion Performance Via a Renov..:
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2020 China Semiconductor Technology International Conference (CSTIC) ,
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Comprehensive Comparison of the Wire Bond Reliability Perfo..:
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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
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bHAST, PCT, TCT reliability performance comparison of Cu-Al..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
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Comprehensive study of wire bond reliability impacts from w..:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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How To Determine Fluorine Contamination Level On A Normal A..:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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A study on an abnormal oxidation issue of copper bonding wi..:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Study of cross contamination between InP substrate and Sili..:
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2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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