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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Numerical study on hybrid discontinuous microchannel heat s..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Embedded cooling method with monolithic dual-layer microcha..:
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2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) ,
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A Gold Bump Flip-chip Interconnection Structure for Face-up..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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Embedded cooling with 3D manifold for high power applicatio..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Inlet/outlet induced failures during flip-chip bonding of l..:
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2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) ,
14
A Coupled-line Coupler with Column Grid Array Pins for RF M..:
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2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) ,
15