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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Low Temperature Cu/SiO2 Hybrid Bonding with Protruding Copp..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Through-silicon-via Architecture of 3D Integration for Supe..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
3
Finite element and phase field simulation methods for homog..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
4
Indium-based Flip-chip Interconnection for Superconducting ..:
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Smart Health; Lecture Notes in Computer Science ,
10