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Yuan, Cadmus
69  results:
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1

The Strategy on Artificial Neural Networks for Predicting A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Su, Qinghua ; Yuan, Cadmus ; Chiang, K.N. - p. 183-184 , 2024
Link: https://doi.org/10.23919..
 
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2

A robust mesh size control technology suitable for various ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chiang, Kuo-Ning ; Lee, C. E. ; Yuan, Cadmus - p. 234-239 , 2024
Link: https://doi.org/10.1109/..
 
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3

Sensitivity Study of Wafer-Level Packaging Lifetime Predict..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Lee, C. E. ; Yuan, Cadmus ; Chiang, K. N. - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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4

AI-assisted Design for Reliability: Review and Perspectives:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Yuan, Cadmus ; M de Jong, S. D. ; Driel, Willem D. van - p. 1-12 , 2024
Link: https://doi.org/10.1109/..
 
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5

Study on the feasible mesh size control method for WLP 3D f..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Chen, Y. J. ; Yuan, Cadmus ; Chiang, K. N. - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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6

Coefficient Extraction of SAC305 Solder Constitutive Equati..:

Yuan, Cadmus ; Su, Qinghua ; Chiang, Kuo-Ning
Materials.  16 (2023)  14 - p. 4922 , 2023
Link: https://doi.org/10.3390/..
 
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7

Fitting Solder305 Anand Model Parameters with Artificial Ne..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Su, Qinghua ; Yuan, Cadmus ; Chiang, K.N. - p. 143-147 , 2023
Link: https://doi.org/10.1109/..
 
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8

Use Artificial Neural Network to fit stress-strain curve of..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lee, C.E. ; Yuan, Cadmus ; Chiang, K.N. - p. 137-142 , 2023
Link: https://doi.org/10.1109/..
 
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9

Development of a Semi-Automatic Probe Card Adjustment Equip..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Gao, Fu Chen ; Chiang, Kuo-Wei ; Tsui, Zhe-Luen.. - p. 267-270 , 2023
Link: https://doi.org/10.1109/..
 
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10

Simulation education utilizing phantom and angle reference ..:

Tsai, Chiao-Yun ; Tsai, Stella Chin-Shaw ; Hsieh, Ming-Yu...
Heliyon.  9 (2023)  7 - p. e18329 , 2023
Link: https://doi.org/10.1016/..
 
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11

Equation Informed Neural Networks with Bayesian Inference I..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Yuan, Cadmus ; Wang, Jing Yu ; Lee, Cheng En. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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12

Biomechanical evaluation of bridge span with three implant ..:

Huang, Ling-Shiuan ; Huang, Yen-Chang ; Yuan, Cadmus..
Journal of Dental Sciences.  18 (2023)  1 - p. 248-263 , 2023
Link: https://doi.org/10.1016/..
 
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13

Wafer-level packaging solder joint reliability lifecycle pr..:

Kuo, Hsuan-Chen ; Chang, Chih-Yi ; Yuan, Cadmus.
Journal of Mechanics.  39 (2023)  - p. 183-190 , 2023
Link: https://doi.org/10.1093/..
 
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14

Continous AI-aided learning to establish the digital twin m..:

, In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Yuan, Cadmus - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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15

An AI-Based Adaptive Surrogate Modeling Method for the In-S..:

Yuan, Cadmus
Electronics.  11 (2022)  18 - p. 2861 , 2022
Link: https://doi.org/10.3390/..
 
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