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2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT) ,
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High-Flatness and Broadband Comb Generator Chip:
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2019 20th International Conference on Electronic Packaging Technology(ICEPT) ,
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Optimal Design of Thermal Characteristics Based on Orthogon..:
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Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004. ,
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An analytical breakdown model of high voltage SOI device co..:
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Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004. ,
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