Search for persons
X
?
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
3
CFD Simulations of Reactive Multi-Layer Usage in Joining Pr..:
, In:
?
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
4
Simulation of temperature profiles in reflow ovens for sold..:
, In:
?
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
5
Temperature evaluation of solder joints for adjusting reflo..:
, In:
?
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
7
Thermal Assessment of Soldering MLCC Components:
, In:
?
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
11
Reactive Die Bonding on LTCC Substrates – Analysis by CFD S..:
, In:
?
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
12