Yung, Chih-sheng
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3

Advanced Fan-Out Embedded Chip Process Integration for 3D A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsiao, Chih-Cheng ; Hsu, Chao-Kai ; Li, Ching-Iang... - p. 181-182 , 2024
 
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4

Void Migration Kinetics in Fine Line Cu RDL under Electric ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Huang, Yen-Cheng ; Tsai, Min-Yan ; Lin, Ting-Chun... - p. 576-580 , 2024
 
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5

Direct Observation of Void Nucleation and Growth in a 2-µm-..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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6

Lightweight CNN and Image Enhancement Using in Palm Vein Re..:

, In: 2023 Asia Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA ASC),
 
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8

Fine-Pitch $30\ \mu \mathrm{m}$ Cu-Cu Bonding using Electro..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lin, Yung-Sheng ; Chiang, Chun-Wei ; Hung, Yun-Ching... - p. 1115-1118 , 2023
 
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10

Integrated Medicine for Chemotherapy-Induced Peripheral Neu..:

Tsai, Chih-Hung ; Lin, Yuan-Ho ; Li, Yung-Sheng...
International Journal of Molecular Sciences.  22 (2021)  17 - p. 9257 , 2021
 
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11

Assessment of Rainfall-Induced Landslide Distribution Based..:

Tseng, Chih-Ming ; Chen, Yie-Ruey ; Chang, Chwen-Ming..
ISPRS International Journal of Geo-Information.  10 (2021)  4 - p. 209 , 2021
 
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