Zeng, Xiangliang
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5

High damping, soft and reprocessable thermal interface mate..:

Rao, Shipeng ; Fan, Jianfeng ; Zhou, Yu...
Composites Science and Technology.  247 (2024)  - p. 110428 , 2024
 
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6

Insight into the fracture energy dissipation mechanism in e..:

He, Dongyi ; Cheng, Xiaxia ; Wong, Chunyu...
Physical Chemistry Chemical Physics.  26 (2024)  5 - p. 4429-4436 , 2024
 
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7

Effect of Filler Particle Size and Surface Functionalizatio..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
 
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10

Experimental validation of a simple fractional model for vi..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Fan, Jianfeng ; Wu, Weijian ; Zeng, Xiangliang... - p. 1-6 , 2023
 
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12

Adaptable thermal conductive, high toughness and compliant ..:

Ji, Yinggang ; Wen, Zhibin ; Fan, Jianfeng...
Composites Science and Technology.  231 (2023)  - p. 109840 , 2023
 
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13

High energy dissipation composite elastomer for application..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
 
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14

How chemical cross-linking and entanglements in polybutadie..:

Zeng, Xiangliang ; Xia, Xinnian ; Fan, JianFeng..
Physical Chemistry Chemical Physics.  25 (2023)  20 - p. 14463-14470 , 2023
 
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15

Dual Reversible Network Nanoarchitectonics for Ultrafast Li..:

Fan, Jianfeng ; Wu, Weijian ; Zeng, Xiangliang...
ACS Applied Materials & Interfaces.  15 (2023)  32 - p. 38996-39007 , 2023
 
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