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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
1
Stress-strain analysis and optimization of laminated solder..:
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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
2
Thermal stress analysis and optimization of BGA stacked sol..:
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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
3
Stress-strain analysis and optimization of TSV interconnect..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
4
QFP solder joint bending stress analysis and parameter opti..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
5
SMT Placement Station Allocation Optimization Model Design ..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
6
Stress-Strain Analysis and Parameter Optimization of Sop So..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
7
Stress Analysis and Optimization of BGA Solder Joints Under..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
8
Object detection of welding defects in SMT electronics prod..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
10
Optimisation of PID control algorithms for lithography wafe..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
11
Stress Analysis Optimization And Prediction Of Stack BGA So..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
12
Finite element simulation of double-layer BGA solder joints..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
13
Stress analysis and optimization of microscale CSP solder j..:
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2021 22nd International Conference on Electronic Packaging Technology (ICEPT) ,
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