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Zhang, Huaiquan
46  results:
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1

Stress-strain analysis and optimization of laminated solder..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wu, Liye ; Huang, Chunyue ; Liu, Xiaobin... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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2

Thermal stress analysis and optimization of BGA stacked sol..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Xianjia ; Huang, Chunyue ; Wang, Lilin... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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3

Stress-strain analysis and optimization of TSV interconnect..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Lilin ; Huang, Chunyue ; Wu, Liye... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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4

QFP solder joint bending stress analysis and parameter opti..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Liu, Xianjia ; Huang, Chunyue ; Wang, Lilin... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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5

SMT Placement Station Allocation Optimization Model Design ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Huaiquan ; Huang, Chunyue ; Liao, Shuaidong... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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6

Stress-Strain Analysis and Parameter Optimization of Sop So..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wu, Liye ; Huang, Chunyue ; Liu, Xiaobin... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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7

Stress Analysis and Optimization of BGA Solder Joints Under..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Liu, Xiaobin ; Huang, Chunyue ; Wu, Liye... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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8

Object detection of welding defects in SMT electronics prod..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Liao, Shuaidong ; Huang, Chunyue ; Zhang, Huaiquan... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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9

Solder Joint Defect Inspection Method Based on ConvNeXt-YOL..:

Liao, Shuaidong ; Huang, Chunyue ; Liang, Ying..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  11 - p. 1890-1898 , 2022
Link: https://doi.org/10.1109/..
 
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10

Optimisation of PID control algorithms for lithography wafe..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Jinfeng, Gong ; Huang, Chuyue ; Zhang, Huaiquan... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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11

Stress Analysis Optimization And Prediction Of Stack BGA So..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Li, Maolin ; Huang, Chun-Yue ; Wang, Zhuo... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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12

Finite element simulation of double-layer BGA solder joints..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Zhuo ; Huang, Chunyue ; Li, Maolin... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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13

Stress analysis and optimization of microscale CSP solder j..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Lilin ; Huang, Chunyue ; Liu, Xianjia... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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14

Method of predicting the maximum stress of BGA solder joint..:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Huaiquan ; Huang, Chunyue ; Liao, Shuaidong. - p. 1-5 , 2021
Link: https://doi.org/10.1109/..
 
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15

Wind resource assessment and micro-siting: science and engi..:

Zhang, Matthew Huaiquan , 2015
Link: https://onlinelibrary.wi..
 
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