Zhang, Xc
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1

3D FO package technology using bridge die for high number o..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zhuang, Jiaming ; Li, Shangxuan ; Zhang, Xc... - p. 1-6 , 2023
 
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2

Hamiltonian System and Viscoelastic Boundary Conditions:

Zhang, WX ; Zhang, XC
Journal of Physics: Conference Series.  1676 (2020)  1 - p. 012120 , 2020
 
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3

Double pulse excitation for enhancing THz generation in liq..:

, In: 2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz),
Ponomareva, E. ; Putilin, S. ; Gendrina, A.... - p. 1-2 , 2019
 
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4

Genome‐wide screening for components of small interfering R..:

Xu, H‐J. ; Chen, T. ; Ma, X‐F....
Insect Molecular Biology.  22 (2013)  6 - p. 635-647 , 2013
 
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5

Verifying a temporal disaggregation method for generating d..:

Zhang, X-C
International Journal of Climatology.  33 (2012)  2 - p. 326-342 , 2012
 
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6

Elaidic acid enhanced the simultaneous neurotoxicity attrib..:

Zhang, MA ; Chen, FH ; Huang, ZY.
Toxicology and Industrial Health.  27 (2011)  7 - p. 661-672 , 2011
 
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7

Effects of sediment load on hydraulics of overland flow on ..:

Zhang, Guang-hui ; Shen, Rui-chang ; Luo, Rong-ting..
Earth Surface Processes and Landforms.  35 (2010)  15 - p. 1811-1819 , 2010
 
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10

A comparison of explicit and implicit spatial downscaling o..:

Zhang, X-C
Climatic Change.  84 (2007)  3-4 - p. 337-363 , 2007
 
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11

Comparison between pulsed terahertz time-domain imaging and..:

Karpowicz, Nicholas ; Zhong, Hua ; Xu, Jingzhou...
Semiconductor Science and Technology.  20 (2005)  7 - p. S293-S299 , 2005
 
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12

Terahertz emission from the structures containing low-tempe..:

Krotkus, A ; Bertulis, K ; Liu, Kai..
Semiconductor Science and Technology.  19 (2004)  4 - p. S452-S453 , 2004
 
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13

Pulsed terahertz tomography:

Wang, S ; Zhang, X-C
Journal of Physics D: Applied Physics.  37 (2004)  4 - p. R1-R36 , 2004
 
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14

Free-space coherent broadband terahertz time-domain spectro..:

Han, P Y ; Zhang, X-C
Measurement Science and Technology.  12 (2001)  11 - p. 1747-1756 , 2001
 
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