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Zhi, Ding
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1

Stoichiometric ratios in soil are relevant to the abundance..:

Ying, Liu ; Maohua, Ma ; Zhi, Ding...
CATENA.  234 (2024)  - p. 107548 , 2024
Link: https://doi.org/10.1016/..
 
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2

Light–acquisition traits link aboveground biomass and envir..:

Ying, Liu ; Maohua, Ma ; Zhi, Ding...
Science of The Total Environment.  857 (2023)  - p. 159660 , 2023
Link: https://doi.org/10.1016/..
 
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3

Plant–plant interactions vary greatly along a flooding grad..:

Ying, Liu ; Yanfeng, Wang ; Wenzhou, Wu...
Frontiers in Plant Science.  14 (2023)  - p. , 2023
Link: https://doi.org/10.3389/..
 
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4

Stress–dilatancy behavior of dense marine calcareous sand u..:

He, Shao-Heng ; Zhi, Ding ; Sun, Yifei..
Ocean Engineering.  244 (2022)  - p. 110437 , 2022
Link: https://doi.org/10.1016/..
 
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5

Deep learning based RF fingerprinting for device identifica..:

Wu, Qingyang ; Feres, Carlos ; Kuzmenko, Daniel...
Electronics Letters.  54 (2018)  24 - p. 1405-1407 , 2018
Link: https://doi.org/10.1049/..
 
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6

On TDD cross-tier in-band interference mitigation: A practi..:

, In: 2012 7th International ICST Conference on Cognitive Radio Oriented Wireless Networks and Communications (CROWNCOM),
Cierny, Michal ; Wichman, Risto ; Hamalainen, Jyri... - p. None , 2012
Link: https://doi.org/10.4108/..
 
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7

Prevalence of Nontuberculous Mycobacteria and the Emergence..:

Hongmei, Shi ; Ruixia, Liang ; Jiankang, Li...
Epidemiology and Infection.  , 2024
Link: https://doi.org/10.1017/..
 
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8

Genomic copy number variation of the CHKB gene alters gene ..:

Goshu, Habtamu Abera ; Chu, Min ; Xiaoyun, Wu...
Molecular Genetics and Genomics.  294 (2019)  3 - p. 549-561 , 2019
Link: https://doi.org/10.1007/..
 
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9

Thermo-mechanical design of fan-out wafer level package for..:

, In: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC),
Chen, Zhaohui ; Gongyue, Tang ; Long, Lau Boon... - p. 1-6 , 2017
Link: https://doi.org/10.1109/..
 
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10

Process and Reliability of Large Fan-Out Wafer Level Packag..:

, In: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC),
Rao, Vempati Srinivasa ; Chong, Chai Tai ; Ho, David... - p. 615-622 , 2017
Link: https://doi.org/10.1109/..
 
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11

Development of High Density Fan Out Wafer Level Package (HD..:

, In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC),
Rao, Vempati Srinivasa ; Chong, Chai Tai ; Ho, David... - p. 1522-1529 , 2016
Link: https://doi.org/10.1109/..
 
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12

N546 in β18–β19 loop is important for binding and toxicity ..:

Xiang, Wang Fa ; Qiu, Xia Li ; Zhi, Ding Xue...
Journal of Invertebrate Pathology.  101 (2009)  2 - p. 119-123 , 2009
Link: https://doi.org/10.1016/..
 
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13

Exploiting Partial FDD Reciprocity for Beam-Based Pilot Pre..:

Lin, Yu-Chien ; Lee, Ta-Sung ; Ding, Zhi
IEEE Transactions on Wireless Communications.  23 (2024)  2 - p. 1474-1488 , 2024
Link: https://doi.org/10.1109/..
 
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14

Divergent responses of subtropical evergreen and deciduous ..:

Han, Lei ; Chen, Yanan ; Wang, Ying...
Environmental Research Letters.  19 (2024)  5 - p. 054043 , 2024
Link: https://doi.org/10.1088/..
 
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15

Afforestation alters soil microbial community composition a..:

Yu, Pujia ; Tang, Hanya ; Sun, Xizao...
Land Degradation & Development.  35 (2024)  8 - p. 2926-2939 , 2024
Link: https://doi.org/10.1002/..
 
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