E-LIB Suche - Ergebnisse für: Zhong, Su-juan

1

Review of ultrasonic-assisted soldering in Sn-based solder ..:

Chen, Chen ; Zhang, Liang ; Wang, Xi...
Journal of Materials Science: Materials in Electronics. 34 (2023) 7 - p. , 2023

Link: https://doi.org/10.1007/..

2

Development of lead-free interconnection materials in elect..:

Zhong, Su-juan ; Zhang, Liang ; Li, Mu-lan..
Materials & Design. 215 (2022) - p. 110439 , 2022

Link: https://doi.org/10.1016/..

3

Influence of copper nanowires on properties and microstruct..:

Li, Zhi-Hao ; Zhang, Liang ; Gao, Li-Li...
Journal of Materials Science: Materials in Electronics. 33 (2022) 10 - p. 7923-7932 , 2022

Link: https://doi.org/10.1007/..

4

Interfacial reaction and properties of Sn/Cu solder reinfor..:

Li, Mu-lan ; Gao, Li-li ; Zhang, Liang...
Journal of Materials Science: Materials in Electronics. 32 (2021) 22 - p. 26666-26675 , 2021

Link: https://doi.org/10.1007/..

5

Materials modification of the lead-free solders incorporate..:

Li, Mu-lan ; Zhang, Liang ; Jiang, Nan..
Materials & Design. 197 (2021) - p. 109224 , 2021

Link: https://doi.org/10.1016/..

6

Influences of silicon carbide nanowires' addition on IMC gr..:

Li, Mu-lan ; Zhang, Liang ; Jiang, Nan..
Journal of Materials Science: Materials in Electronics. 32 (2021) 13 - p. 18067-18075 , 2021

Link: https://doi.org/10.1007/..

7

Influence of doping Ti particles on intermetallic compounds..:

Jiang, Nan ; Zhang, Liang ; Long, Wei-min..
Journal of Materials Science: Materials in Electronics. 32 (2021) 3 - p. 3341-3351 , 2021

Link: https://doi.org/10.1007/..

8

Interfacial evolution of pure Sn solder bearing silicon car..:

Li, Mu-lan ; Gao, Li-li ; Zhang, Liang...
Journal of Materials Research and Technology. 15 (2021) - p. 3974-3982 , 2021

Link: https://doi.org/10.1016/..

9

Microstructure evolution of Cu/Sn58Bi/Cu solder joint beari..:

Jiang, Nan ; Zhang, Liang ; Gao, Li-li...
Journal of Materials Science: Materials in Electronics. 32 (2021) 12 - p. 16970-16978 , 2021

Link: https://doi.org/10.1007/..

10

Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of S..:

Zhang, Liang ; Zhong, Su-Juan
Frontiers in Materials. 8 (2021) - p. , 2021

Link: https://doi.org/10.3389/..

11

Review of microstructure and properties of low temperature ..:

Xu, Kai-Kai ; Zhang, Liang ; Gao, Li-Li...
Science and Technology of Advanced Materials. 21 (2020) 1 - p. 689-711 , 2020

Link: https://doi.org/10.1080/..

12

Properties and microstructure evolution of Sn–Cu–Ni/Cu join..:

Zhang, Liang ; Jiang, Nan ; He, Peng.
Journal of Materials Science: Materials in Electronics. 31 (2020) 23 - p. 21758-21766 , 2020

Link: https://doi.org/10.1007/..

13

Deformation treatment and microstructure of graphene-reinfo..:

Mei, Yong ; Shao, Pu-zhen ; Sun, Ming...
International Journal of Minerals, Metallurgy and Materials. 27 (2020) 7 - p. 888-899 , 2020

Link: https://doi.org/10.1007/..

14

Properties and microstructure of Sn–0.7Cu–0.05Ni lead-free ..:

Liu, Shuang ; Xue, Song-bai ; Zhong, Su-juan..
Journal of Materials Science: Materials in Electronics. 30 (2018) 2 - p. 1400-1410 , 2018

Link: https://doi.org/10.1007/..

15

Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC:

Zhang, Liang ; Liu, Zhi-quan ; Yang, Fan.
Soldering & Surface Mount Technology. 29 (2017) 3 - p. 151-155 , 2017

Link: https://doi.org/10.1108/..