Search for persons
X
?
2024 International Conference on Electronics Packaging (ICEP) ,
1
Temperature-Dependent Electrical Resistivity in Sn-Bi Alloy:
, In:
?
2024 International Conference on Electronics Packaging (ICEP) ,
5
Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Fre..:
, In:
?
2024 IEEE 2nd International Conference on Power Science and Technology (ICPST) ,
6
Monitoring Method and Application of Icing Thickness and Ic..:
, In:
?
2023 International Conference on Electronics Packaging (ICEP) ,
7
Evolution of the Sn-Bi Solder Microstructure vs. Temperatur..:
, In:
?
2022 International Conference on Electronics Packaging (ICEP) ,
10