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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
1
Indium-based Flip-chip Interconnection for Superconducting ..:
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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
2
A Low loss feed line for patch antenna based on silicon in ..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
3