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Computational and Experimental Simulations in Engineering; Mechanisms and Machine Science ,
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Multi-Chip 3D Integrated Micro-System Based on Microwave Mu..:
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Computational and Experimental Simulations in Engineering; Mechanisms and Machine Science ,
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Design of RF Micro-system Based on Multi-chip Stacking:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
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Effect of surface energy on the bond strength of conductive..:
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2018 19th International Conference on Electronic Packaging Technology (ICEPT) ,
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Material and structural optimization of fatigue life of PBG..:
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Lecture Notes in Electrical Engineering; Proceedings of 2023 7th Chinese Conference on Swarm Intelligence and Cooperative Control ,
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An Improved Genetic Algorithm with Tabu Tables for Flexible..:
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2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC) ,
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