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Zulkifli, Muhammad Nubli
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1

Ultrasonic Al Bond on Mo Back-Contact Layer of CIGS Solar P..:

Hamid, Sabarina Abdul ; Zulkifli, Muhammad Nubli ; Jalar, Azman...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  6 - p. 1123-1133 , 2024
Link: https://doi.org/10.1109/..
 
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2

Micromechanical and microstructure evolution of leaded (SnP..:

Zulkifli, Muhammad Nubli ; Abdullah, Izhan ; Azhan, Nurul Hanis.
Journal of Adhesion Science and Technology.  , 2024
Link: https://doi.org/10.1080/..
 
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3

Effect of ultrasonic bonding and lamination on electrical p..:

Basher, Hassan ; Zulkifli, Muhammad Nubli ; Jalar, Azman.
Journal of Adhesion Science and Technology.  38 (2024)  14 - p. 2477-2496 , 2024
Link: https://doi.org/10.1080/..
 
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4

Electrical Characterization of Ultrasonic Aluminum Bond on ..:

, In: Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium,
Zulkifli, Muhammad Nubli ; Abdul Hamid, Sabarina - p. 115-122 , 2023
Link: https://doi.org/10.1007/..
 
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5

Effect of Ultrasonic Process Parameter on Resistance and Pl..:

, In: TENCON 2023 - 2023 IEEE Region 10 Conference (TENCON),
Hamid, Sabarina Abdul ; Zulkifli, Muhammad Nubli ; Jalar, Azman... - p. 1288-1292 , 2023
Link: https://doi.org/10.1109/..
 
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6

Microstructure Evaluation of Photovoltaic Solar Panel's Int..:

Hamid, Sabarina Abdul ; Zulkifli, Muhammad Nubli
Materials Science Forum.  1055 (2022)  - p. 27-35 , 2022
Link: https://doi.org/10.4028/..
 
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7

Bondability of ultrasonic Aluminum bonds on the molybdenum ..:

Basher, Hassan ; Zulkifli, Muhammad Nubli ; Rahmat, Mohd Khairil...
Solar Energy.  228 (2021)  - p. 516-522 , 2021
Link: https://doi.org/10.1016/..
 
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8

Relationship of Mechanical and Micromechanical Properties w..:

Abdullah, Izhan ; Zulkifli, Muhammad Nubli ; Jalar, Azman..
Journal of Electronic Materials.  48 (2019)  5 - p. 2826-2839 , 2019
Link: https://doi.org/10.1007/..
 
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9

Effect of surface roughness and hardness of leadframe on th..:

Zulkifli, Muhammad Nubli ; Harun, Fuaida ; Jalar, Azman
Microelectronics International.  36 (2019)  2 - p. 62-67 , 2019
Link: https://doi.org/10.1108/..
 
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10

Deformation behavior relationship between tensile and nanoi..:

Abdullah, Izhan ; Zulkifli, Muhammad Nubli ; Jalar, Azman.
Soldering & Surface Mount Technology.  30 (2018)  3 - p. 194-202 , 2018
Link: https://doi.org/10.1108/..
 
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11

Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wir..:

Abdullah, Izhan ; Zulkifli, Muhammad Nubli ; Jalar, Azman.
Soldering & Surface Mount Technology.  29 (2017)  2 - p. 110-117 , 2017
Link: https://doi.org/10.1108/..
 
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12

Effect of Applied Load in the Nanoindentation of Gold Ball ..:

Zulkifli, Muhammad Nubli ; Jalar, Azman ; Abdullah, Shahrum..
Journal of Electronic Materials.  42 (2013)  6 - p. 1063-1072 , 2013
Link: https://doi.org/10.1007/..
 
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13

Strength distribution of Au ball bond using nanoindentation..:

Zulkifli, Muhammad Nubli ; Jalar, Azman ; Abdullah, Shahrum..
Materials Science and Engineering: A.  577 (2013)  - p. 189-196 , 2013
Link: https://doi.org/10.1016/..
 
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14

Some thoughts on bondability and strength of gold wire bond..:

Zulkifli, Muhammad Nubli ; Abdullah, Shahrum ; Othman, Norinsan Kamil.
Gold Bulletin.  45 (2012)  3 - p. 115-125 , 2012
Link: https://doi.org/10.1007/..
 
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15

Rapid fabrication and characterization of PDMS microfluidic..:

Aziz, Azman A. ; Azraie Mohd Azmi, Mohd ; Nubli Zulkifli, Muhammad...
Materials Today: Proceedings.  16 (2019)  - p. 1661-1667 , 2019
Link: https://doi.org/10.1016/..
 
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