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de Marneffe, Jean-François
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1

Overview of scalable transfer approaches to enable epitaxia..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Brems, Steven ; Ghosh, Souvik ; Smets, Quentin... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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2

Ru/Ta bilayer approach to EUV mask absorbers: Experimental ..:

Thakare, Devesh ; de Marneffe, Jean-François ; Delabie, Annelies.
Micro and Nano Engineering.  20 (2023)  - p. 100223 , 2023
Link: https://doi.org/10.1016/..
 
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3

Reactive plasma cleaning and restoration of transition meta..:

Marinov, Daniil ; de Marneffe, Jean-François ; Smets, Quentin...
npj 2D Materials and Applications.  5 (2021)  1 - p. , 2021
Link: https://doi.org/10.1038/..
 
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4

Characterization of Ru4-xTax (x = 1,2,3) alloy as material ..:

Wu, Meiyi ; de Marneffe, Jean-François ; Opsomer, Karl...
Micro and Nano Engineering.  12 (2021)  - p. 100089 , 2021
Link: https://doi.org/10.1016/..
 
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5

Enhancing interface doping in graphene-metal hybrid devices..:

Achra, Swati ; Akimoto, Tomoki ; de Marneffe, Jean-François...
Applied Surface Science.  538 (2021)  - p. 148046 , 2021
Link: https://doi.org/10.1016/..
 
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6

Mechanisms of hydrogen atom interactions with MoS2 monolaye:

Voronina, Ekaterina N ; Mankelevich, Yuri A ; Novikov, Lev S...
Journal of Physics: Condensed Matter.  32 (2020)  44 - p. 445003 , 2020
Link: https://doi.org/10.1088/..
 
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7

Use of a Thermally Degradable Chemical Vapor Deposited Poly..:

Marneffe, Jean-François de ; Yamaguchi, Tatsuya ; Fujikawa, Makoto...
ACS Applied Electronic Materials.  1 (2019)  12 - p. 2602-2611 , 2019
Link: https://doi.org/10.1021/..
 
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8

Conversion of a Patterned Organic Resist into a High Perfor..:

Marneffe, Jean-François de ; Chan, Boon Teik ; Spieser, Martin...
ACS Nano.  12 (2018)  11 - p. 11152-11160 , 2018
Link: https://doi.org/10.1021/..
 
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9

The conversion mechanism of amorphous silicon to stoichiome..:

Heyne, Markus H. ; de Marneffe, Jean-François ; Nuytten, Thomas...
Journal of Materials Chemistry C.  6 (2018)  15 - p. 4122-4130 , 2018
Link: https://doi.org/10.1039/..
 
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10

Mechanisms for plasma cryogenic etching of porous materials:

Zhang, Quan-Zhi ; Tinck, Stefan ; de Marneffe, Jean-François..
Applied Physics Letters.  111 (2017)  17 - p. , 2017
Link: https://doi.org/10.1063/..
 
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11

The effects of vacuum-ultraviolet radiation on defects in l..:

Xue, Panpan ; Pei, Dongfei ; Zheng, Huifeng...
Thin Solid Films.  616 (2016)  - p. 23-26 , 2016
Link: https://doi.org/10.1016/..
 
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12

Cu passivation for integration of gap-filling ultralow-k di..:

Zhang, Liping ; de Marneffe, Jean-Francois ; Lesniewska, Alicja...
Applied Physics Letters.  109 (2016)  23 - p. , 2016
Link: https://doi.org/10.1063/..
 
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13

Integration of porous low-kdielectrics using post porosity ..:

Zhang, Liping ; de Marneffe, Jean-François ; Verdonck, Patrick...
Journal of Physics D: Applied Physics.  49 (2016)  50 - p. 505105 , 2016
Link: https://doi.org/10.1088/..
 
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14

Mitigation of plasma-induced damage in porous low-kdielectr..:

Zhang, Liping ; de Marneffe, Jean-François ; Leroy, Floriane...
Journal of Physics D: Applied Physics.  49 (2016)  17 - p. 175203 , 2016
Link: https://doi.org/10.1088/..
 
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15

Stuffing-enabled surface confinement of silanes used as sea..:

Sun, Yiting ; Levrau, Elisabeth ; Zhang, Liping...
Microelectronic Engineering.  137 (2015)  - p. 70-74 , 2015
Link: https://doi.org/10.1016/..
 
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