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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
8
Physics-Informed Machine Learning for Solder Joint Qualific..:
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Recent Advances in Microelectronics Reliability ,
9
Health Monitoring Fatigue Properties of Solder Interconnect..:
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
10