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van der Plas, Geert
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1

Effects of Nozzle Pitch Adaptation in Micro-Scale Liquid Je..:

Elsinger, Georg ; Oprins, Herman ; Cherman, Vladimir...
Fluids.  9 (2024)  3 - p. 69 , 2024
Link: https://doi.org/10.3390/..
 
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2

Block level and package level thermal assessment for back s..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lofrano, Melina ; Oprins, Herman ; Cherman, Vladimir... - p. 1036-1043 , 2024
Link: https://doi.org/10.1109/..
 
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3

A 32 Gb/s Full duplex Bi-directional Transceiver with Cross..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Park, Jae-Woo ; Pantano, Nicolas ; Van Der Plas, Geert.. - p. 1072-1077 , 2024
Link: https://doi.org/10.1109/..
 
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4

Impact of Pitch Scaling on 3D Die-to-Die Interconnects:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Pantano, Nicolas ; Stucchi, Michele ; Van der Plas, Geert. - p. 1064-1071 , 2024
Link: https://doi.org/10.1109/..
 
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5

ESD mitigation for 3D IC hybrid bonding:

, In: 2023 45th Annual EOS/ESD Symposium (EOS/ESD),
Lin, Shih-Hsiang ; Simicic, Marko ; Pantano, Nicolas... - p. 1-9 , 2023
Link: https://doi.org/10.23919..
 
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6

Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch..:

, In: 2023 IEEE International 3D Systems Integration Conference (3DIC),
Naeim, Mohamed ; Yang, Hanqi ; Chen, Pinhong... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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7

Thermal and Mechanical characterization of embedded PTCQ pa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Weis, Gerald ; Schwarz, Timo ; Cherman, Vladimir.. - p. 537-541 , 2023
Link: https://doi.org/10.1109/..
 
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8

Impact of gate-level clustering on automated system partiti..:

Delhaye, Quentin ; Beyne, Eric ; Goossens, Joël..
Microelectronics Journal.  139 (2023)  - p. 105896 , 2023
Link: https://doi.org/10.1016/..
 
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9

ESD process assessment of 2.5D and 3D bonding technologies:

, In: 2023 45th Annual EOS/ESD Symposium (EOS/ESD),
Simicic, Marko ; Gijbels, Frank ; Iacovo, Serena... - p. 1-7 , 2023
Link: https://doi.org/10.23919..
 
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10

Analysis and Application of a Surface Admittance Operator f..:

Bosman, Dries ; Huynen, Martijn ; De Zutter, Daniël...
IEEE Transactions on Microwave Theory and Techniques.  71 (2023)  7 - p. 2794-2806 , 2023
Link: https://doi.org/10.1109/..
 
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11

NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integr..:

, In: 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE),
Iturbe, Xabier ; Abderrahmane, Nassim ; Abella, Jaume... - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
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12

Efficient Characterization of Interconnects With Arbitrary ..:

Bosman, Dries ; Huynen, Martijn ; De Zutter, Daniël...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  10 - p. 1567-1575 , 2023
Link: https://doi.org/10.1109/..
 
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13

Low temperature backside damascene processing on temporary ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Beyne, Eric ; Beyer, Gerald... - p. 1108-1113 , 2022
Link: https://doi.org/10.1109/..
 
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14

Efficient Backside Power Delivery for High-Performance Comp..:

Lin, Hesheng ; van der Plas, Geert ; Sun, Xiao...
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  30 (2022)  11 - p. 1748-1756 , 2022
Link: https://doi.org/10.1109/..
 
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15

Interconnect Modeling using a Surface Admittance Operator D..:

, In: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Bosman, Dries ; Huynen, Martijn ; De Zutter, Daniel... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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